Datasheet

Information furnished is believed to be accurate and reliable. However, SGS-THOMSON Microelectronics assumes no responsability for the
consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No
license is granted by implication or otherwise under any patent or patent rights of SGS-THOMSON Microelectronics. Specifications mentioned
in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied.
SGS-THOMSON Microelectronics products are notauthorized for use as critical components in life support devices or systems without express
written approval of SGS-THOMSON Microelectronics.
1995 SGS-THOMSON Microelectronics - All rights reserved.
Purchase of I
2
C Components by SGS-THOMSON Microelectronics, conveys a license under the Philips
I
2
C Patent. Rights to use these components in anI
2
C system, is granted provided that the system conforms to
the I
2
C Standard Specifications as defined by Philips.
SGS-THOMSON Microelectronics GROUP OF COMPANIES
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Cooling method by convection and conduction
Marking : type number
Weight : 0.15 g
PACKAGE MECHANICAL DATA (in millimeters)
DO 35 Glass
Polarity : N A
Stud torque : N A
note 2
BA B
C
note 1
note 1
D
D
O
/
O
/
O/
E
E
REF. DIMENSIONS NOTES
Millimeters Inches
Min. Max. Min. Max.
A 3.050 4.500 0.120 0.117
1 - The lead diameter D is not controlled over zone E
2 - The minimum axiallengh within which the device may be
placed with its leads bent at right angles is 0.59”(15 mm)
B 12.7 0.500
C 1.530 2.000 0.060 0.079
D 0.458 0.558 0.018 0.022
E 1.27 0.050
DB3 / DB4 / DC34
4/4