Datasheet

BTA16, BTB16 and T16 Series
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Figure 1: Maximum power dissipation versus
RMS on-state current (full cycle)
Figure 2: RMS on-state current versus case
temperature (full cycle)
Figure 3: RMS on-state current versus ambient
temperature (printed circuit board FR4, copper
thickness: 35µm) (full cycle)
Figure 4: Relative variation of thermal
impedance versus pulse duration
Figure 5: On-state characteristics (maximum
values)
Figure 6: Surge peak on-state current versus
number of cycles
0246810121416
0
2
4
6
8
10
12
14
16
18
20
P(W)
I (A)
T(RMS)
0 25 50 75 100 125
0
2
4
6
8
10
12
14
16
18
I (A)
T(RMS)
T (°C)
C
BTA
BTB / T16
0 25 50 75 100 125
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
I (A)
T(RMS)
T (°C)
C
DPAK
(S=1cm )
2
2
1E-3 1E-2 1E-1 1E+0 1E+1 1E+2 5E+2
1E-2
1E-1
1E+0
K=[Z /R
th th
]
t (s)
p
Z
th(j-c)
Z
th(j-a)
0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
1
10
100
200
I (A)
TM
V (V)
TM
T max.
V = 0.85V
R = 25 m
j
to
d
Ω
T=
j
T max.
j
T = 25°C
j
.
1 10 100 1000
0
20
40
60
80
100
120
140
160
180
I (A)
TSM
Number of cycles
t=20ms
One cycle
Non repetitive
T initial=25°C
j
Repetitive
T =85°C
C