Datasheet

ManualsBrandsST ManualsDiscrete SemiconductorsPower Transistor, TO-220, PNP, 100V

Rev 4

September 2005 1/8

BD243C

BD244C

COMPLEMENTARY SILICON POWER TRANSISTOR

Features

■ STmicroelectronics PREFERRED

SALESTYPES

Applications

■ SWITCHING APPLICATIONS

■ LINEAR APPLICATIONS

Description

The BD243C device is a silicon Epitaxial-Base

NPN transistor mounted in Jedec TO-220 plastic

package. It’s intend for use in medium power

linear and switching applications. The

complementary PNP type is BD244C.

Order Codes

Internal Schematic Diagram

TO-220

Part Number Marking Package Packing

BD243C BD243C TO-220 TUBE

BD244C BD244C TO-220 TUBE

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Summary of content (8 pages)

PAGE 1
BD243C BD244C COMPLEMENTARY SILICON POWER TRANSISTOR Features ■ STmicroelectronics PREFERRED SALESTYPES Applications ■ SWITCHING APPLICATIONS ■ LINEAR APPLICATIONS 3 1 Description 2 TO-220 The BD243C device is a silicon Epitaxial-Base NPN transistor mounted in Jedec TO-220 plastic package. It’s intend for use in medium power linear and switching applications. The complementary PNP type is BD244C.
PAGE 2
BD243C - BD244C 1 Absolute Maximum Ratings 1 Absolute Maximum Ratings Table 1. Absolute Maximum Rating Symbol Parameter Value BD243C (NPN) BD244C (PNP) VCBO Collector-Base Voltage (IE = 0) 100 V VCEO Collector-Emitter Voltage (IB = 0) 100 V VEBO Collector-Base Voltage (IC = 0) 5 V Collector Current 6 A Collector Peak Current 10 A Base Current 2 A PTOT Total dissipation at Tc = 25°C 65 W TSTG Storage Temperature -65 to 150 °C 150 °C IC ICM IB TJ Max.
PAGE 3
BD243C - BD244C 2 2 Electrical Characteristics Electrical Characteristics Table 2. Symbol Electrical Characteristics (TCASE = 25°C; unless otherwise specified) Parameter Test Conditions Min. Typ. Max. Unit ICES Collector Cut-off Current (V BE = 0) VCE = rated VCEO 0.4 mA ICEO Collector Cut-off Current (IB = 0) VCE = 60 V 0.
PAGE 4
2 Electrical Characteristics 2.1 Typical characteristics Figure 1.
PAGE 5
BD243C - BD244C 3 3 Package Mechanical Data Package Mechanical Data In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a Lead-free second level interconnect . The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark.
PAGE 6
BD243C - BD244C 3 Package Mechanical Data TO-220 MECHANICAL DATA DIM. mm. MIN. inch MAX. MIN. TYP. MAX. A 4.40 4.60 0.173 0.181 b 0.61 0.88 0.024 0.034 b1 1.15 1.70 0.045 0.066 c 0.49 0.70 0.019 0.027 D 15.25 15.75 0.60 0.620 E 10 10.40 0.393 0.409 e 2.40 2.70 0.094 0.106 e1 4.95 5.15 0.194 0.202 F 1.23 1.32 0.048 0.052 H1 6.20 6.60 0.244 0.256 J1 2.40 2.72 0.094 0.107 0.551 L 13 14 0.511 L1 3.50 3.93 0.137 L20 16.40 L30 6/8 TYP 0.
PAGE 7
BD243C - BD244C 4 4 Revision History Revision History Date Revision 13-Sep-2005 4 Changes New datasheet according to MLD-PWR/05/1267 New template 7/8
PAGE 8
BD243C - BD244C 4 Revision History Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice.