User's Manual

SPZB32W1A2.1 / SPZB32W1C2.1

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6 - SOLDERING

Soldering phase has to be carefully executed: in order to avoid undesired melting phenomenon, particular attention has to be

taken on the set up of the Peak Temperature.

Here following some suggestions for the temperature profile based on IPC/JEDEC J-STD-020C, July 2004 recommendations

Profile feature PB free assembly

Average ramp up rate ( TSMAX to TP) 3°C / sec max

Preheat

Temperature min ( T

S MIN)

Temperature max ( T

S MAX)

Time (T

S MIN to TS MAX) ( tS )

150 ° C

200 ° C

60 – 100 sec

Time maintained above :

Temperature T

Time tL

217 ° C

40 – 70 sec

Peak Temperature (Tp) 240 + 0 ° C

Time within 5°C of actual peak temperature (tP) 10 – 20 sec

Ramp down rate 6 °C / sec

Time from 25° C to peak temperature 8 minutes max