User's Manual

Module reflow
SPWF04SA, SPWF04SC
6 Module reflow
The SPWF04SA and SPWF04SC are surface mount modules with a 6-layer PCB. The
recommended final assembly reflow profiles are indicated below.
The soldering phase must be executed with care: in order to prevent an undesired melting
phenomenon, particular attention must be paid to the setup of the peak temperature.
The following are some suggestions for the temperature profile based on the IPC/JEDEC J-
STD-020C, July 2004 recommendations.
Table 6. Soldering values
Profile feature
PB-free assembly
Average ramp-up rate (T
SMAX
to T
P
)
3 °C/sec max
Preheat:
– Temperature min. (T
s
min.)
– Temperature max. (T
s
max.)
– Time (T
s
min. to T
s
max) (ts)
150 °C
200 °C
60-100 sec
Critical zone:
Temperature T
L
Time T
L
217 °C
60-70 sec
Peak temperature (T
P
)
240 + 0 °C
Time within 5 °C of actual peak temperature (T
P
)
10-20 sec
Ramp-down rate
6 °C/sec
Time from 25 °C to peak temperature
8 minutes max.
Figure 2. Soldering profile
AM17477v1
10/18 DocID025635 Rev 7