User's Manual

January
2016 DocID0xxxxx Rev 0.17
This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to change
without notice. www.st.com
6 Hardware design
SPBT3.0DP2 module with DP command embedded FW supports UART, I
2
C and GPIO
hardware interfaces.
Note: - All unused pins should be left floating; do not ground.
• All GND pins must be well grounded.
• The area around the module should be free of any ground planes, power planes, trace
routings, or metal for 6 mm from the module antenna position, in all directions.
• Traces should not be routed underneath the module.
6.1 Reflow soldering
The SPBT3.0DP2 is a high temperature strength surface mount Bluetooth
®
module supplied
on an 18 pin, 6-layer PCB. The final assembly recommended reflow profiles are indicated
here below.
Soldering phase must be executed with care: in order to avoid undesired melting
phenomenon, particular attention must be paid to the set-up of the peak temperature.
Here following some suggestions for the temperature profile based on the following
recommendations.
Table 6: Soldering
Profile feature
PB-free assembly
Average ramp-up rate (T
SMAX
to T
P
)
3 °C/sec max
Preheat:
– Temperature min. (T
S
min.)
– Temperature max. (T
S
max.)
– Time (t
s
min. to t
s
max.)(t
s
)
150 °C
200 °C
60-100 sec
Time maintained above:
– Temperature T
L
– Temperature T
L
217 °C
60-70 sec
Peak temperature (T
P
)
240 + 0 °C
Time within 5 °C of actual peak temperature (T
P
)
10-20 sec
Ramp-down rate
6 °C/sec
Time from 25 °C to peak temperature
8 minutes max.