User Manual

SPNYH02-C Bluetooth module datasheet
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Note: The module is LGA package. Please be careful of the amount of solder paste. The module may
be lifted due to excess solder.
11.2 Usage Condition Notes
• Follow the conditions written in this specification, especially the recommended condition ratings
about the power supply applied to this product.
• The supply voltage has to be free of AC ripple voltage (for example from a battery or a low noise
regulator output). For noisy supply voltages, provide a decoupling circuit (for example a ferrite in
series connection and a bypass capacitor to ground of at least 47uF directly at the module).
• Take measures to protect the unit against static electricity. If pulses or other transient loads (a large
load applied in a short time) are applied to the products, check and evaluate their operation before
assembly on the final products.
• The supply voltage should not be exceedingly high or reversed. It should not carry noise and/or
spikes.
• This product away from other high frequency circuits.
• Keep this product away from heat. Heat is the major cause of decreasing the life of these products.
• Avoid assembly and use of the target equipment in conditions where the product’s temperature
may exceed the maximum tolerance.
• This product should not be mechanically stressed when installed.
• Do not use dropped products.
• Do not touch, damage or soil the pins.
• Pressing on parts of the metal shield or fastening objects to the metal shield will cause damage.