Bluetooth module datasheet SPINTLY SPNYH02-C High Efficiency 2.4GHz Wireless Module SPNYH02-C Datasheet MODEL NO: SPNYH02-C VERSION: P01 CONTENTS www.spintly.
Bluetooth module datasheet Table of Contents 1. Product Description .......................................................................................................................................... 4 2. Key Features ...................................................................................................................................................... 4 3. Applications ......................................................................................................................
SPNYH02-C Bluetooth module datasheet • Additional testing:........................................................................................................................................ 20 • USERS MANUAL OF THE END PRODUCT: ..................................................................................................... 21 Contact Information............................................................................................................................................. 21 www.
SPNYH02-C Bluetooth module datasheet 1. Product Description SPNYH02-C series is a powerful, highly flexible, ultra-low power wireless module using Nordic nRF52833 SoCs made for IOT applications. It was designed for high data rate wireless communication in the 2.4GHz ISM band. With an 32bit ARM® Cortex M4 MCU, available 512KB flash, 128KB RAM, embedded 2.4GHz multi-protocol transceiver. SPNYL01 series brings out all nRF52833 hardware features and capabilities including USB, up to +8dBm transmit power, 5.
SPNYH02-C Bluetooth module datasheet • Advanced wearables • Health/fitness sensor and monitor devices • Wireless payment enabled devices • Advanced computer peripherals and I/O devices • Mouse • Keyboard • Multi-touch trackpad • Interactive entertainment devices • Remote controls • Gaming controllers 4. Module Block Diagram Figure 1: SPNYH02-C lock diagram www.spintly.
SPNYH02-C Bluetooth module datasheet 5.
SPNYH02-C Bluetooth module datasheet Interfaces Power supply Operating temperature range Clock control Power regulator www.spintly.com 4x SPI master/3x SPI slave with EasyDMA 2x I2C compatible two-wire master/slave 2x UART (CTS/RTS) with EasyDMA 3x real-time counter (RTC) 5x 32-bit timer with counter mode 4x 4-channel pulse width modulator (PWM) unit with EasyDMA 40 GPIOs 8x 12bit, 200ksps ADC Audio peripherals – I 2 S, digital microphone interface (PDM) 1.7V to 5.
SPNYH02-C Bluetooth module datasheet 6 Module Pinout and Pin Description 6.1 Module Pinout Figure 2: SPNYH02-C Module Pinout www.spintly.
SPNYH02-C Bluetooth module datasheet 6.2 Pin Assignment Module Pin Number Module Pin Name Description 18 PO.25 P0.23 P0.03 AIN1 P0.02 AIN0 P0.28 AIN4 PO.29 AIN5 PO.30 AIN6 PO.31 AIN7 VDD GND P0.27 P0.26 P0.04 AIN2 P0.06 P0.05 AIN3 P0.08 P0.09 NFC1 P0.10 NFC2 19 SWDCLK 20 23 SWDIO P0.07 TRACECLK PO.11 TRACEDATA[2] PO.
SPNYH02-C Bluetooth module datasheet 27 28 29 30 31 32 33 34,35 36 37 38 39 40 PO.16 PO.17 PO.18 nRESET P0.20 P0.21 P0.22 P0.24 GND P1.05 P1.03 GND GND P0.19 General Purpose I/O General Purpose I/O General purpose I/O, Configurable as pin reset General Purpose I/O General Purpose I/O General Purpose I/O General Purpose I/O Ground General Purpose I/O General Purpose I/O Ground Ground General Purpose I/O 41 42 VDDH GND High Voltage Power supply Ground 43 49 50 P1.08 P1.
SPNYH02-C Bluetooth module datasheet 7. PCB Design Guide 7.1 Layout notes Please do not place any metal components in blue shaded space (*1), such as signal line and metal chassis as possible except for main board while mounting the components in *1 space on the main board is allowed except for no copper plating area (*2). • (*2) This area is routing prohibited area on the main board. Please do not place copper on any layer. • (*3) Characteristics may deteriorate when GND pattern length is less than 30mm.
SPNYH02-C Bluetooth module datasheet • • No ground plane below antenna. If possible, cut-off the portion of main board below antenna. www.spintly.
SPNYH02-C Bluetooth module datasheet Placement of metal parts: • Minimum safe distance for metal parts without seriously compromising the antenna (tuning) is 40 mm top/bottom and 30 mm left or right. • Metal close to the module antenna (bottom, top, left, right, any direction) will have degradation on the antenna performance. The amount of that degradation is entirely system dependent, meaning you will need to perform some testing with your host application.
SPNYH02-C Bluetooth module datasheet 9. PCB Footprint and Dimensions www.spintly.
SPNYH02-C Bluetooth module datasheet 10. Qualification and approvals 10.1. United States (FCC) The SPNYH02-C has received Federal Communications Commission (FCC) CFR47 Telecommunications, Part 15 Subpart C “Intentional Radiators” modular approval in accordance with Part 15.247 Modular Transmitter approval.
SPNYH02-C Bluetooth module datasheet 10.2.1. Radio Equipment Directive (RED) 2014/53/EU The SPNYH02-C module complies with the essential requirements and other relevant provisions of Radio Equipment Directive (RED) 2014/53/EU. 10.2.2. Labelling and user information requirements The label on the final products which contain the module must follow CE marking requirements. The “R&TTE Compliance 11. Cautions 11.1 Reflow soldering Reflow soldering is a vitally important step in the SMT process.
SPNYH02-C Bluetooth module datasheet Note: The module is LGA package. Please be careful of the amount of solder paste. The module may be lifted due to excess solder. 11.2 Usage Condition Notes • Follow the conditions written in this specification, especially the recommended condition ratings about the power supply applied to this product. • The supply voltage has to be free of AC ripple voltage (for example from a battery or a low noise regulator output).
SPNYH02-C Bluetooth module datasheet 11.3 Storage Notes • The module should not be stressed mechanically during storage. • Do not store these products in the following conditions or the performance characteristics of the product, such as RF performance will be adversely affected: • • • • Storage in salty air or in an environment with a high concentration of corrosive gas. Storage in direct sunlight Storage in an environment where the temperature may be outside the range specified.
SPNYH02-C Bluetooth module datasheet • List of applicable FCC rules The Bluetooth Low Energy Module is an BLE Module with digitally modulated systems using an GFSK modulation. It operates on the 2402- 2480MHz band. Complies with FCC CFR Title 47 Part 15 Subpart C Section 15.247. • Specific operational use conditions The 2A3ZU-SPNYH02is a BLE Module Operation Frequency: 2402 - 2480MHz Modulation Type: GFSK Number Of Channel: 40CH Antenna Designation: PCB Antenna and External 2.
Bluetooth module datasheet • Antennas The 2A3ZU-SPNYH02is an BLE Module beams signals and communicates with its antenna, which is PCB Antenna and External 2.4Ghz FPC antenna. Antenna could not be in no load state when module is working.
SPNYH02-C Bluetooth module datasheet 3) For all products market in US, OEM has to limit the operation channels in CH1 to CH11 for 2.4G band by supplied firmware programming tool. OEM shall not supply any tool or info to the end‐user regarding to Regulatory Domain change. • USERS MANUAL OF THE END PRODUCT: In the users manual of the end product, the end user has to be informed to keep at least 20cm separation with the antenna while this end product is installed and operated.
