Data Sheet

Page 54 ams Datasheet
Document Feedback [v1-04] 2018-Jul-09
AS7265x − Soldering & Storage Information
Manufacturing Process Considerations
The AS72651,AS72652 and AS72653 packages are compatible
with standard reflow no-clean and cleaning processes
including aqueous, solvent or ultrasonic techniques. However,
as an open-aperture device, precautions must be taken to avoid
particulate or solvent contamination as a result of any
manufacturing processes, including pick and place, reflow,
cleaning, integration assembly and/or testing. Temporary
covering of the aperture is allowed. To avoid degradation of
accuracy or performance in the end product, care should be
taken that any temporary covering and associated
sealants/debris are thoroughly removed prior to any optical
testing or final packaging.
Storage Information
Moisture Sensitivity
Optical characteristics of the device can be adversely affected
during the soldering process by the release and vaporization of
moisture that has been previously absorbed into the package.
To ensure the package contains the smallest amount of
absorbed moisture possible, each device is baked prior to being
dry packed for shipping.
Devices are dry packed in a sealed aluminized envelope called
a moisture-barrier bag with silica gel to protect them from
ambient moisture during shipping, handling, and storage
before use.
Shelf Life
The calculated shelf life of the device in an unopened moisture
barrier bag is 12 months from the date code on the bag when
stored under the following conditions:
• Shelf Life: 12 months
• Ambient Temperature: <40°C
• Relative Humidity: <90%
Rebaking of the devices will be required if the devices exceed
the 12 month shelf life or the Humidity Indicator Card shows
that the devices were exposed to conditions beyond the
allowable moisture region.