Data Sheet

5.6.2 8-pin UDFN/USON
DRAWING NO. REV. TITLE
GPC
8MA4 B
YAG
Package Drawing Contact:
[e-mail]
01/25/13
8MA4, 8-pad, 2.0x2.0x0.6 mm Body, 0.5 mm pitch,
0.9x1.5 mm Exposed ePad, Ultra-Thin Dual Flat
No Lead Package (UDFN/USON)
f
d
COMMON DIMENSIONS
(Unit of Measure = mm)
SYMBOL
MIN
NOM
MAX
NOTE
A - - 0.60
A1 0.00 - 0.05
b 0.20 - 0.30
D 1.95 2.00 2.05
D2 1.40 1.50 1.60
E 1.95 2.00 2.05
E2 0.80 0.90 1.00
e 0.50 BSC
L 0.20 0.30 0.40
k 0.20 - -
1. All dimensions are in mm. Angles in degrees.
2. Coplanarity applies to the exposed pad as well as the terminals.
Coplanarity shall not exceed 0.05 mm.
3. Warpage shall not exceed 0.05 mm.
4. Refer to JEDEC MO-236/MO-252.
NOTES:
1
4
8
5
b
E2
D2
C0.2
e
D
1
4
PIN 1 ID
E
5
A1
A
C
C
0.05
0.05
8X
C
2 3
678
L
k
Top view
Bottom view
Side view
Side view
A
A1
Note: For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging
AT42QT1011
© 2017 Microchip Technology Inc.
Datasheet
DS40001947A-page 22