Data Sheet
Si4702/03-C19
Rev. 1.1 39
9. Package Markings (Top Marks)
9.1. Si4702 Top Mark
Figure 10. Si4702 Top Mark
9.2. Si4703 Top Mark
Figure 11. Si4703 Top Mark
9.3. Top Mark Explanation
Mark Method: YAG Laser
Line 1 Marking: Part Number 02 = Si4702
03 = Si4703
Firmware Revision 19 = Firmware Revision 19
Line 2 Marking: R = Die Revision C = Revision C Die
TTT = Internal Code Internal tracking code.
Line 3 Marking: Circle = 0.5 mm Diameter
(Bottom-Left Justified)
Pin 1 Identifier
Y = Year
WW = Workweek
Assigned by the Assembly House. Corresponds to the last sig-
nificant digit of the year and workweek of the mold date.