Data Sheet

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ABSOLUTE MAXIMUM RATINGS.
TLC5940
SLVS515C – DECEMBER 2004 – REVISED OCTOBER 2007
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
ORDERING INFORMATION
T
A
PACKAGE
(1)
PART NUMBER
28-pin HTSSOP PowerPAD™ TLC5940PWP
– 40 ° C to 85 ° C 32-pin 5mm x 5mm QFN TLC5940RHB
28-pin PDIP TLC5940NT
(1) For the most current package and ordering information, see the Package Option Addendum at the end
of this document, or see the TI website at www.ti.com .
over operating free-air temperature range (unless otherwise noted)
(1)
UNIT
V
I
Input voltage range
(2)
VCC – 0.3V to 6V
I
O
Output current (dc) 130mA
V
I
Input voltage range V
(BLANK)
, V
(DCPRG)
, V
(SCLK)
, V
(XLAT)
, V
(SIN)
, V
(GSCLK)
, V
(IREF)
– 0.3V to V
CC
+0.3V
V
(SOUT)
, V
(XERR)
– 0.3V to V
CC
+0.3V
V
O
Output voltage range
V
(OUT0)
to V
(OUT15)
– 0.3V to 18V
EEPROM program range V
(VPRG)
– 0.3V to 24V
EEPROM write cycles 50
HBM (JEDEC JESD22-A114, Human Body Model) 2kV
ESD rating
CBM (JEDEC JESD22-C101, Charged Device Model) 500V
T
stg
Storage temperature range – 55 ° C to 150 ° C
T
A
Operating ambient temperature range – 40 ° C to 85 ° C
HTSSOP (PWP)
(4)
31.58 ° C/W
Package thermal impedance
(3)
QFN (RHB) 35.9 ° C/W
PDIP (NP) 48 ° C/W
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute maximum rated conditions for extended periods may affect device reliability.
(2) All voltage values are with respect to network ground terminal.
(3) The package thermal impedance is calculated in accordance with JESD 51-7.
(4) With PowerPAD soldered on PCB with 2 oz. (56,7 grams) trace of copper. See SLMA002 for further information.
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