*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
CD74HC4067M96 SOIC DW 24 2000 346.0 346.0 41.0
CD74HC4067SM96 SSOP DB 24 2000 346.0 346.0 33.0
PACKAGE MATERIALS INFORMATION
www.ti.com
11-Mar-2008
Pack Materials-Page 2
