Datasheet
Table Of Contents
- General Description
- Key Features
- Applications
- System Diagram
- Contents
- Figures
- Tables
- 1 Terms and Definitions
- 2 References
- 3 Block Diagram
- 4 Pinout
- 5 Electrical Specification
- 6 Power Management
- 7 Core System
- 8 Peripherals
- 9 Applications Schematic
- 10 Package Information
- 11 Ordering Information
- Revision History
DA16200MOD
Ultra Low Power Wi-Fi Module
Datasheet
Revision 3.1
03-Feb-2021
CFR0011-120-00
57 of 60
© 2021 Dialog Semiconductor
Table 49: Typical Reflow Profile (Lead Free): J-STD-020C
Profile Feature
Lead Free SMD
Average ramp up rate (Ts
max
to T
p
)
3 °C/s Max.
Preheat
● Temperature Min (Ts
min
)
● Temperature Max (Ts
max
)
● Time (Ts
max
to Ts
min
)
● 150 °C
● 200 °C
● 60 to 180 seconds
Time maintained above
● Temperature (T
L
)
● Time (t
L
)
● 217 °C
● 60 to 150 seconds
Peak/Classification temperature (T
p
)
260 °C
Time within 5 °C of peak temperature (tp)
20 to 40 seconds
Ramp down rate
6 °C/s Max.
Time from 25 °C to peak temperature
8 minutes Max.
Figure 49: Reflow Condition