Datasheet
Table Of Contents
- General Description
- Key Features
- Applications
- System Diagram
- Contents
- Figures
- Tables
- 1 Terms and Definitions
- 2 References
- 3 Block Diagram
- 4 Pinout
- 5 Electrical Specification
- 6 Power Management
- 7 Core System
- 8 Peripherals
- 9 Applications Schematic
- 10 Package Information
- 11 Ordering Information
- Revision History
DA16200MOD
Ultra Low Power Wi-Fi Module
Datasheet
Revision 3.1
03-Feb-2021
CFR0011-120-00
56 of 60
© 2021 Dialog Semiconductor
10.5 Soldering Information
10.5.1 Condition for Reflow Soldering
Figure 48 shows the typical process flow for mounting surface mount packages to PCB.
The reflow profile depends on the solder paste being used and the recommendations from the paste
manufacture should be followed to determine the proper reflow profile. Figure 49 shows a typical
reflow profile when a no-clean paste is used. Oven time above liquidus (260 °C for lead-free solder)
is 20 to 40 seconds.
The rework process involves the following steps:
1. Component removal
2. Site redress
3. Solder paste application
4. Component placement
5. Component attachment
Figure 48: Typical PCB Mounting Process Flow