Datasheet

DA16200MOD
Ultra Low Power Wi-Fi Module
Final
Datasheet
Revision 3.1
03-Feb-2021
CFR0011-120-00
5 of 60
© 2021 Dialog Semiconductor
8.1 QSPI: Master with XIP Feature ........................................................................................... 25
8.2 SPI Master .......................................................................................................................... 27
8.3 SPI Slave ............................................................................................................................ 28
8.4 SDIO.................................................................................................................................... 30
8.5 I2C Interface ........................................................................................................................ 32
8.5.1 I2C Master ........................................................................................................... 32
8.5.2 I2C Slave ............................................................................................................. 33
8.6 SD/SDeMMC ....................................................................................................................... 35
8.6.1 Block Diagram ..................................................................................................... 35
8.7 I2S ....................................................................................................................................... 36
8.7.1 Block Diagram ..................................................................................................... 37
8.7.2 I2S Clock Scheme ............................................................................................... 37
8.7.3 I2S Transmit and Receive Timing Diagram ......................................................... 38
8.8 ADC (Aux 12-bit) ................................................................................................................. 39
8.8.1 Overview .............................................................................................................. 39
8.8.2 Timing Diagram ................................................................................................... 40
8.8.3 DMA Transfer ...................................................................................................... 40
8.8.4 Sensor Wake-up .................................................................................................. 41
8.8.5 ADC Ports ............................................................................................................ 41
8.9 GPIO ................................................................................................................................... 41
8.9.1 Antenna Switching Diversity ................................................................................ 41
8.10 UART ............................................................................................................................. 43
8.10.1 RS-232 ................................................................................................................. 44
8.10.2 RS-485 ................................................................................................................. 45
8.10.3 Baud Rate ............................................................................................................ 45
8.10.4 Hardware Flow Control ........................................................................................ 46
8.10.5 Interrupts .............................................................................................................. 46
8.10.6 DMA Interface ...................................................................................................... 47
8.11 PWM ............................................................................................................................. 48
8.11.1 Timing Diagram ................................................................................................... 48
8.12 Debug Interface ................................................................................................................... 49
8.13 Bluetooth Coexistence ........................................................................................................ 50
8.13.1 Interface Configuration ........................................................................................ 50
8.13.2 Operation Scenario .............................................................................................. 50
9 Applications Schematic .............................................................................................................. 52
10 Package Information ................................................................................................................... 53
10.1 Dimension: DA16200MOD-AAC ......................................................................................... 53
10.2 Dimension: DA16200MOD-AAE ......................................................................................... 53
10.3 PCB Land Pattern ............................................................................................................... 54
10.4 4-Layer PCB Example ......................................................................................................... 55
10.5 Soldering Information .......................................................................................................... 56
10.5.1 Condition for Reflow Soldering ............................................................................ 56
11 Ordering Information .................................................................................................................. 58
Revision History ................................................................................................................................ 59