ESP32C3WROOM02 ESP32C3WROOM02U Datasheet Module with flash and 15 GPIOs Built around RISCV singlecore SoC Supporting IEEE 802.11b/g/n (2.4 GHz WiFi) and Bluetooth 5 (LE) Pre-release v0.7 Espressif Systems Copyright © 2021 www.espressif.
About This Document This document provides specifications for the ESP32-C3-WROOM-02 and ESP32-C3-WROOM-02U modules. Document Updates Please always refer to the latest version on https://www.espressif.com/en/support/download/documents. Revision History For revision history of this document, please refer to the last page. Documentation Change Notification Espressif provides email notifications to keep you updated on changes to technical documentation. Please subscribe at www.espressif.com/en/subscribe.
1 Module Overview 1 Module Overview 1.1 Features • Antenna diversity MCU • 802.11mc FTM • ESP32-C3 embedded, 32-bit RISC-V single-core processor, up to 160 MHz Bluetooth® • 384 KB ROM • 400 KB SRAM (16 KB for cache) • Bluetooth LE: Bluetooth 5, Bluetooth mesh • 8 KB SRAM in RTC • Speed: 125 Kbps, 500 Kbps, 1 Mbps, 2 Mbps • Advertising extensions WiFi • Multiple advertisement sets • IEEE 802.
1 Module Overview 02 comes with a PCB antenna. ESP32-C3-WROOM-02U comes with a U.FL connector for an external IPEX antenna. ESP32-C3-WROOM-02 and ESP32-C3-WROOM-02U have two variants: • 85 °C version operating at –40 ~ 85 °C • 105 °C version operating at –40 ~ 105 °C The two variants only differ in ambient operating temperature.
1 Module Overview – Service robot – Internet radio players • Audio Device • Generic Low-power IoT Sensor Hubs – Internet music players – Live streaming devices Espressif Systems • Generic Low-power IoT Data Loggers 5 ESP32-C3-WROOM-02 & WROOM-02U Datasheet v0.
Contents Contents 1 Module Overview 3 1.1 Features 3 1.2 Description 3 1.3 Applications 4 2 Block Diagram 10 3 Pin Definitions 11 3.1 Pin Layout 11 3.2 Pin Description 11 3.3 Strapping Pins 12 4 Electrical Characteristics 14 4.1 Absolute Maximum Ratings 14 4.2 Recommended Operating Conditions 14 4.3 DC Characteristics (3.3 V, 25 °C) 14 4.4 Current Consumption Characteristics 15 4.5 Wi-Fi Radio 16 4.5.1 Wi-Fi RF Standards 16 4.5.
Contents Revision History Espressif Systems 32 7 ESP32-C3-WROOM-02 & WROOM-02U Datasheet v0.
List of Tables List of Tables 1 Ordering Information 2 Pin Definitions 11 3 Strapping Pins 13 4 Parameter Descriptions of Setup and Hold Times for the Strapping Pin 13 5 Absolute Maximum Ratings 14 6 Recommended Operating Conditions 14 7 DC Characteristics (3.3 V, 25 °C) 14 8 Current Consumption Depending on RF Modes 15 9 Current Consumption Depending on Work Modes 15 10 Wi-Fi RF Standards 16 11 TX Power with Spectral Mask and EVM Meeting 802.
List of Figures List of Figures 1 ESP32-C3-WROOM-02 Block Diagram 10 2 ESP32-C3-WROOM-02U Block Diagram 10 3 Pin Layout (Top View) 11 4 Setup and Hold Times for the Strapping Pin 13 5 ESP32-C3-WROOM-02 Schematics 23 6 ESP32-C3-WROOM-02U Schematics 24 7 Peripheral Schematics 25 8 ESP32-C3-WROOM-02 Physical Dimensions 26 9 ESP32-C3-WROOM-02U Physical Dimensions 26 10 ESP32-C3-WROOM-02 Recommended PCB Land Pattern 27 11 ESP32-C3-WROOM-02U Recommended PCB Land Pattern 28 12 U.
2 Block Diagram 2 Block Diagram 40 MHz Crystal 3V3 Antenna RF Matching ESP32-C3 GPIOs SPICS0 SPICLK SPID SPIQ SPIHD SPIWP VDD_SPI EN SPI Flash ESP32-C3-WROOM-02 Figure 1: ESP32C3WROOM02 Block Diagram 40 MHz Crystal 3V3 Antenna RF Matching ESP32-C3 GPIOs SPICS0 SPICLK SPID SPIQ SPIHD SPIWP VDD_SPI EN SPI Flash ESP32-C3-WROOM-02U Figure 2: ESP32C3WROOM02U Block Diagram Espressif Systems 10 ESP32-C3-WROOM-02 & WROOM-02U Datasheet v0.
3 Pin Definitions 3 Pin Definitions 3.1 Pin Layout The pin diagram below shows the approximate location of pins on the module. For the actual diagram drawn to scale, please refer to Figure 7.1 Physical Dimensions. Keepout Zone 1 3V3 IO0 18 2 EN IO1 17 3 IO4 IO2 16 4 IO5 IO3 15 IO19 14 IO18 13 GND GND GND GND Pin 19 GND GND GND GND GND 5 IO6 6 IO7 7 IO8 TXD 12 8 IO9 RXD 11 9 GND IO10 10 Figure 3: Pin Layout (Top View) 3.
3 Pin Definitions Table 2 – cont’d from previous page Name 1 No.
3 Pin Definitions To change the strapping bit values, you can apply the external pull-down/pull-up resistances, or use the host MCU’s GPIOs to control the voltage level of these pins when powering on ESP32-C3 family. After reset, the strapping pins work as normal-function pins. Refer to Table 3 for a detailed boot-mode configuration of the strapping pins.
4 Electrical Characteristics 4 Electrical Characteristics 4.1 Absolute Maximum Ratings Stresses above those listed in Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
4 Electrical Characteristics Table 7 – cont’d from previous page Symbol Parameter VIH_nRST VIL_nRST Min Chip reset release voltage Typ 0.75 × VDD Chip reset voltage 1 –0.3 1 VDD is the I/O voltage for a particular power domain of pins. 2 VOH and VOL are measured using high-impedance load. — — Max Unit 1 VDD + 0.3 0.25 × VDD V 1 V 4.4 Current Consumption Characteristics With the use of advanced power-management technologies, the module can switch between different power modes.
4 Electrical Characteristics 4.5 WiFi Radio 4.5.1 WiFi RF Standards Table 10: WiFi RF Standards Name Description Center frequency range of operating channel 1 2412 ~ 2484 MHz Wi-Fi wireless standard IEEE 802.11b/g/n 11b: 1, 2, 5.5 and 11 Mbps 20 MHz Data rate 11g: 6, 9, 12, 18, 24, 36, 48, 54 Mbps 11n: MCS0-7, 72.
4 Electrical Characteristics Table 12 – cont’d from previous page Rate Min Typ SL1 (dB) (dB) (dB) 802.11n, HT40, MCS 0, @18.5 dBm — –26.5 –5 802.11n, HT40, MCS 7, @17 dBm — –30.5 –27 1 SL stands for standard limit value. 4.5.3 WiFi RF Receiver (RX) Specifications Table 13: RX Sensitivity Min Typ Max (dBm) (dBm) (dBm) 802.11b, 1 Mbps — –98.0 — 802.11b, 2 Mbps — –96.0 — 802.11b, 5.5 Mbps — –93.0 — 802.11b, 11 Mbps — –88.6 — 802.11g, 6 Mbps — –93.0 — 802.
4 Electrical Characteristics Table 14: Maximum RX Level Min Typ Max (dBm) (dBm) (dBm) 802.11b, 1 Mbps — 5 — 802.11b, 11 Mbps — 5 — 802.11g, 6 Mbps — 5 — 802.11g, 54 Mbps — 0 — 802.11n, HT20, MCS 0 — 5 — 802.11n, HT20, MCS 7 — 0 — 802.11n, HT40, MCS 0 — 5 — 802.11n, HT40, MCS 7 — 0 — Rate Table 15: RX Adjacent Channel Rejection Rate Min Typ Max (dB) (dB) (dB) 802.11b, 1 Mbps — 35 — 802.11b, 11 Mbps — 35 — 802.11g, 6 Mbps — 31 — 802.
4 Electrical Characteristics Table 17: Transmitter Characteristics Bluetooth LE 1M Parameter Description In-band emissions Modulation characteristics Carrier frequency offset Carrier frequency drift Min Typ Max Unit F = F0 ± 2 MHz — –37.62 — dBm F = F0 ± 3 MHz — –41.95 — dBm F = F0 ± > 3 MHz — –44.48 — dBm ∆ f 1avg — 245.00 — kHz ∆ f 2max — 208.00 — kHz ∆ f 2avg /∆ f 1avg — 0.93 — — — — –9.00 — kHz |f0 − fn |n=2, 3, 4, ..k — 1.17 — kHz |f1 − f0 | — 0.
4 Electrical Characteristics Table 20: Transmitter Characteristics Bluetooth LE 500K Parameter Description In-band emissions Modulation characteristics Carrier frequency offset Carrier frequency drift Min Typ Max Unit F = F0 ± 2 MHz — –37.90 — dBm F = F0 ± 3 MHz — –41.30 — dBm F = F0 ± > 3 MHz — –42.80 — dBm ∆ f 2avg — 220.00 — kHz ∆ f 2max — 205.00 — kHz — — –11.90 — kHz |f0 − fn |n=1, 2, 3, ..k — 1.37 — kHz |f0 − f3 | — 1.09 — kHz |fn − fn−3 |n=7, 8, 9, .
4 Electrical Characteristics Table 22: Receiver Characteristics Bluetooth LE 2M Parameter Description Sensitivity @30.8% PER — — –93 — dBm Maximum received signal @30.
4 Electrical Characteristics Table 24 – cont’d from previous page Parameter Adjacent channel selectivity C/I Image frequency Adjacent channel to image frequency Espressif Systems Description Min Typ Max Unit F = F0 + 1 MHz — –6 — dB F = F0 – 1 MHz — –7 — dB F = F0 + 2 MHz — –34 — dB F = F0 – 2 MHz — –37 — dB F ≥ F0 + 3 MHz — –38 — dB F ≤ F0 – 3 MHz — –40 — dB F ≥ F0 + 4 MHz — –40 — dB F ≤ F0 – 4 MHz — –42 — dB — — –40 — dB F = Fimage + 1 MHz — –45 —
4 3 2 5 Module Schematics 1 5 Module Schematics This is the reference design of the module. D D 3 GND XOUT 1 The value of R1 varies with the actual PCB board. C2 TBD GND 40MHz(±10ppm) 0 VDD33 GND 2 C1 TBD The values of C1 and C2 vary with the selection of the crystal.
5 Module Schematics D GND 3 GND XOUT 1 The value of R1 varies with the actual PCB board. C2 TBD GND 40MHz(±10ppm) 0 VDD33 GND 2 XIN C1 TBD The values of C1 and C2 vary with the selection of the crystal. U1 GND GND 4 Espressif Systems D C5 C6 C7 10uF 0.1uF 0.
5 4 3 6 Peripheral Schematics 6 Peripheral Schematics This is the typical application circuit of the module connected with peripheral components (for example, power supply, antenna, reset button, JTAG interface, and UART interface). VDD33 0.
7 Physical Dimensions and PCB Land Pattern 7 Physical Dimensions and PCB Land Pattern 7.1 Physical Dimensions Unit: mm 18±0.15 3.2±0.15 0.4 0.7 2.9 8.04 18 x 0.45 1.15 0.4 0.7 6.7 2.9 18 x 0.9 0.71 0. 5 12.37 15.7 Ø 18 x 0.9 0.9 1.5 18 x Ø0.55 12 20±0.15 6 0.8 18 x 0.85 Top View Bottom View Side View Figure 8: ESP32C3WROOM02 Physical Dimensions Unit: mm 18±0.15 3.2±0.15 2.75 0.8 2.9 2.9 0.4 0.7 6.7 18 x 0.9 2.3 0.78 8.85 12.75 18 x 0.9 0.9 1.5 12 14.3±0.15 15.
7 Physical Dimensions and PCB Land Pattern 7.2 Recommended PCB Land Pattern Unit: mm Via for thermal pad Copper 6 Antenna Area 18 x 1.5 7.1 18 18 1 20 1.5 2.9 0.9 18 x 0.9 0.4 0.4 0.7 0.7 6.7 2.9 9.96 9 10 17.5 0.5 0.5 Figure 10: ESP32C3WROOM02 Recommended PCB Land Pattern Espressif Systems 27 ESP32-C3-WROOM-02 & WROOM-02U Datasheet v0.
7 Physical Dimensions and PCB Land Pattern Unit: mm Via for thermal pad Copper 18 18 x 1.5 0.7 6.7 2.9 9.96 9 14.3 1.5 2.9 0.9 18 x 0.9 0.4 0.4 0.7 1.4 18 1 10 17.5 0.5 0.5 Figure 11: ESP32C3WROOM02U Recommended PCB Land Pattern Espressif Systems 28 ESP32-C3-WROOM-02 & WROOM-02U Datasheet v0.
7 Physical Dimensions and PCB Land Pattern 7.3 U.FL Connector Dimensions Unit: mm Figure 12: U.FL Connector Dimensions Espressif Systems 29 ESP32-C3-WROOM-02 & WROOM-02U Datasheet v0.
8 Product Handling 8 Product Handling 8.1 Storage Conditions The products sealed in moisture barrier bags (MBB) should be stored in a non-condensing atmospheric environment of < 40 °C and /90%RH. The module is rated at the moisture sensitivity level (MSL) of 3. After unpacking, the module must be soldered within 168 hours with the factory conditions 25±5 °C and /60%RH. If the above conditions are not met, the module needs to be baked. 8.
9 Learning Resources 9 Learning Resources 9.1 MustRead Documents Please familiarize yourself with the following documents: • ESP32-C3 Family Datasheet This is an introduction to the specifications of ESP32-C3 family’s hardware, including overview, pin definitions, functional description, peripheral interface, electrical characteristics, etc. • ESP-IDF Programming Guide Extensive documentation for the ESP-IDF development framework, ranging from hardware guides to API reference.
Revision History Revision History Date Version 2021-05-17 V0.7 2021-04-16 V0.6 Added information about ESP32-C3-WROOM-02U module 2021-03-05 V0.5 Preliminary release Espressif Systems Release notes • Updated Section 3.3 Strapping Pins • Updated ESP32-C3-WROOM-02U Physical Dimensions 32 ESP32-C3-WROOM-02 & WROOM-02U Datasheet v0.
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