Datasheet
Table Of Contents
- 1 Module Overview
- 2 Block Diagram
- 3 Pin Definitions
- 4 Electrical Characteristics
- 5 Schematics
- 6 Peripheral Schematics
- 7 Physical Dimensions and PCB Layout
- 8 Product Handling
- 9 MAC Addresses and eFuse
- 10 Learning Resources
- Revision History
7.2 Recommended PCB Land Pattern
Unit: mm
Copper
Via for thermal pad
Antenna Area
18.00
25.50
1.50
1.27
1.27
2.00
0.90
5.00
5.00
1.33
1.33
10.51
8.00
0.50
0.50
1
15 24
38
6.30
17.00
Figure 11: ESP32WROOM32E Recommended PCB Land Pattern
Note:
Location and pattern of thermal pad is designed for compatibility with former ESP32-WROVER and ESP32-WROVER-B
modules and has wider area and bigger pad size than on the modules. Space on the landing pattern between the pads
should be covered with solder mask.
For more information on the pad design, please refer to ESP32 Hardware Design Guidelines.
Espressif Systems 27
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ESP32-WROOM-32E & ESP32-WROOM-32UE Datasheet V1.1