Datasheet

8. Product Handling
8. Product Handling
8.1 Storage Condition
The products sealed in Moisture Barrier Bag (MBB) should be stored in a noncondensing atmospheric environment
of < 40 °C/90%RH.
The module is rated at moisture sensitivity level (MSL) 3.
After unpacking, the module must be soldered within 168 hours with factory conditions 25±5 °C and /60%RH.
The module needs to be baked if the above conditions are not met.
8.2 ESD
• Human body model (HBM): 2000 V
• Charged-device model (CDM): 500 V
• Air discharge: 6000 V
• Contact discharge: 4000 V
8.3 Reflow Profile
50
150
0
25
1 ~ 3 ℃/s
0
200
250
200
–1 ~ –5 ℃/s
Cooling zone
100
217
50
100 250
Reflow zone
217 ℃ 60 ~ 90 s
Temperature (℃)
Preheating zone
150 ~ 200 ℃ 60 ~ 120 s
Ramp-up zone
Peak Temp.
235 ~ 250 ℃
Soldering time
> 30 s
Time (sec.)
Ramp-up zone — Temp.: 25 ~ 150 ℃ Time: 60 ~ 90 s Ramp-up rate: 1 ~ 3 ℃/s
Preheating zone — Temp.: 150 ~ 200 ℃ Time: 60 ~ 120 s
Reflow zone — Temp.: >217 ℃ 60 ~ 90 s; Peak Temp.: 235 ~ 250 ℃ Time: 30 ~ 70 s
Cooling zone — Peak Temp. ~ 180 ℃ Ramp-down rate: –1 ~ –5 ℃/s
Solder — Sn-Ag-Cu (SAC305) lead-free solder alloy
Figure 10: Reflow Profile
Note:
Solder the module in a single reflow. If the PCBA requires multiple reflows, place the module on the PCB during the final
reflow.
Espressif Systems 24
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ESP32-S2-WROOM & ESP32-S2-WROOM-I Datasheet V1.1