ESP32-S2-WROOM & ESP32-S2-WROOM-I Datasheet Version 1.1 Espressif Systems Copyright © 2020 www.espressif.
About This Document This document provides the specifications for the ESP32-S2-WROOM and ESP32-S2-WROOM-I module. Document Updates Please always refer to the latest version on https://www.espressif.com/en/support/download/documents. Revision History For revision history of this document, please refer to the last page. Documentation Change Notification Espressif provides email notifications to keep customers updated on changes to technical documentation. Please subscribe at www.espressif.com/en/subscribe.
1. Module Overview 1. Module Overview 1.1 Features MCU Hardware • Interfaces: GPIO, SPI, LCD, UART, I2 C, I2 S, Cam- • ESP32-S2 embedded, Xtensa® single-core 32-bit era interface, IR, pulse counter, LED PWM, USB LX7 microprocessor, up to 240 MHz OTG 1.1, ADC, DAC, touch sensor, temperature • 128 KB ROM sensor • 40 MHz crystal oscillator • 320 KB SRAM • 4 MB SPI flash • 16 KB SRAM in RTC • Operating voltage/Power supply: 3.0 ~ 3.
1. Module Overview At the core of this module is ESP32-S2 *, an Xtensa® 32-bit LX7 CPU that operates at up to 240 MHz. The chip has a low-power co-processor that can be used instead of the CPU to save power while performing tasks that do not require much computing power, such as monitoring of peripherals. ESP32-S2 integrates a rich set of peripherals, ranging from SPI, I²S, UART, I²C, LED PWM, LCD, Camera interface, ADC, DAC, touch sensor, temperature sensor, as well as up to 43 GPIOs.
CONTENTS Contents 1 Module Overview 3 1.1 Features 3 1.2 Description 3 1.3 Applications 4 2 Block Diagram 8 3 Pin Definitions 9 3.1 Pin Layout 9 3.2 Pin Description 10 3.3 Strapping Pins 11 4 Electrical Characteristics 13 4.1 Absolute Maximum Ratings 13 4.2 Recommended Operating Conditions 13 4.3 DC Characteristics (3.3 V, 25 °C) 13 4.4 Current Consumption Characteristics 14 4.5 Wi-Fi RF Characteristics 15 4.5.1 Wi-Fi RF Standards 15 4.5.
LIST OF TABLES List of Tables 1 Ordering Information 2 Pin Definitions 10 3 Strapping Pins 11 4 Absolute Maximum Ratings 13 5 Recommended Operating Conditions 13 6 DC Characteristics (3.3 V, 25 °C) 13 7 Current Consumption Depending on RF Modes 14 8 Current Consumption Depending on Work Modes 14 9 Wi-Fi RF Standards 15 10 Transmitter Characteristics 15 11 Receiver Characteristics 16 Espressif Systems 3 6 ESP32-S2-WROOM & ESP32-S2-WROOM-I Datasheet V1.
LIST OF FIGURES List of Figures 1 ESP32-S2-WROOM Block Diagram 8 2 ESP32-S2-WROOM-I Block Diagram 8 3 Module Pin Layout (Top View) 9 4 ESP32-S2-WROOM Schematics 18 5 ESP32-S2-WROOM-I Schematics 19 6 Peripheral Schematics 20 7 Physical Dimensions 21 8 Recommended PCB Land Pattern 22 9 U.FL Connector Dimensions 23 10 Reflow Profile 24 Espressif Systems 7 ESP32-S2-WROOM & ESP32-S2-WROOM-I Datasheet V1.
2. Block Diagram 2. Block Diagram 40 MHz Crystal 3V3 Antenna RF Matching ESP32-S2 GPIOs SPICS SPICLK SPIDI SPIDO SPIHD SPIWP VDD_SPI EN SPI Flash ESP32-S2-WROOM Figure 1: ESP32-S2-WROOM Block Diagram 40 MHz Crystal 3V3 Antenna RF Matching ESP32-S2 GPIOs SPICS SPICLK SPIDI SPIDO SPIHD SPIWP VDD_SPI EN SPI Flash ESP32-S2-WROOM-I Figure 2: ESP32-S2-WROOM-I Block Diagram Espressif Systems 8 ESP32-S2-WROOM & ESP32-S2-WROOM-I Datasheet V1.
3. Pin Definitions 3. Pin Definitions 3.
3. Pin Definitions Note: The pin diagram shows the approximate location of pins on the module. For the actual mechanical diagram, please refer to Figure 7.1 Physical Dimensions. 3.2 Pin Description The module has 42 pins. See pin definitions in Table 2. Table 2: Pin Definitions Name No.
3. Pin Definitions Name No. Type Function IO40 34 I/O/T MTDO, GPIO40, CLK_OUT2 IO41 35 I/O/T MTDI, GPIO41, CLK_OUT1 IO42 36 I/O/T MTMS, GPIO42 TXD0 37 I/O/T U0TXD, GPIO43, CLK_OUT1 RXD0 38 I/O/T U0RXD, GPIO44, CLK_OUT2 IO45 39 I/O/T GPIO45 IO46 40 I GPIO46 High: on, enables the chip. EN 41 I Low: off, the chip powers off. Note: Do not leave the EN pin floating. GND 42 P Ground Notice: For peripheral pin configurations, please refer to ESP32-S2 Datasheet. 3.
3. Pin Definitions Booting Mode Pin Default SPI Boot Download Boot IO0 Pull-up 1 0 IO46 Pull-down Don’t-care Enabling/Disabling ROM Code Print During Booting 0 3 4 Pin Default Enabled Disabled IO46 Pull-down See the fourth note See the fourth note Note: 1. Firmware can configure register bits to change the settings of ”VDD_SPI Voltage”. 2. The strapping combination of GPIO46 = 1 and GPIO0 = 0 is invalid and will trigger unexpected behavior. 3.
4. Electrical Characteristics 4. Electrical Characteristics 4.1 Absolute Maximum Ratings Table 4: Absolute Maximum Ratings Min Max Power supply voltage –0.3 3.6 V Storage temperature –40 85 °C Symbol Parameter VDD33 TST ORE Unit 4.2 Recommended Operating Conditions Table 5: Recommended Operating Conditions Symbol Parameter Min Typ Max VDD33 Power supply voltage 3.0 3.3 3.6 V IV DD Current delivered by external power supply 0.
4. Electrical Characteristics Note: 1. VDD is the I/O voltage for a particular power domain of pins. 2. VOH and VOL are measured using high-impedance load. 4.4 Current Consumption Characteristics With the use of advanced power-management technologies, the module can switch between different power modes. For details on different power modes, please refer to Section RTC and Low-Power Management in ESP32S2 Datasheet.
4. Electrical Characteristics tion changes accordingly. • In Modem-sleep mode, the CPU frequency changes automatically. The frequency depends on the CPU load and the peripherals used. • During Deep-sleep, when the ULP co-processor is powered on, peripherals such as GPIO and I²C are able to operate. • The ”ULP sensor-monitored pattern” refers to the mode where the ULP coprocessor or the sensor works periodically. When touch sensors work with a duty cycle of 1%, the typical current consumption is 22 µA. 4.
4. Electrical Characteristics 4.5.3 Receiver Characteristics Table 11: Receiver Characteristics Parameter RX Sensitivity RX Maximum Input Level Adjacent Channel Rejection Espressif Systems Rate Typ 1 Mbps –97 2 Mbps –95 5.
4. Electrical Characteristics Parameter Espressif Systems Rate Typ 11n, HT40, MCS0 19 11n, HT40, MCS7 8 17 Unit ESP32-S2-WROOM & ESP32-S2-WROOM-I Datasheet V1.
5 3 2 1 5. Schematics 5. Schematics C3 100pF 1uF 3 GND GND XOUT TBD D C4 TBD 2 C2 C1 XIN VDD33 Y1 GND GND The value of R4 varies with the actual PCB board. 4 GND The values of C1 and C4 vary with the selection of the crystal. 1 Espressif Systems D 4 VDD33 VDD33 GND R1 10K(NC) CHIP_PU GPIO46 GPIO45 U0RXD U0TXD GPIO42 GPIO41 GPIO40 GPIO39 C13 C14 0.
5 3 2 1 5. Schematics C2 C3 100pF 1uF TBD 3 GND GND XOUT C1 XIN VDD33 Y1 GND GND The value of R4 varies with the actual PCB board. C4 D TBD 2 The values of C1 and C4 vary with the selection of the crystal. 4 GND 1 Espressif Systems D 4 VDD33 VDD33 GND R1 10K(NC) CHIP_PU GPIO46 GPIO45 U0RXD U0TXD GPIO42 GPIO41 GPIO40 GPIO39 0.1uF 1uF GND VDD33 C16 GND 0.
6. Peripheral Schematics 4 3 2 6. Peripheral Schematics GND GND GND ESP32-S2-WROOM/ESP32-S2-WROOM-I 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 IO0 IO1 C1 C3 IO2 22uF 0.1uF IO3 IO4 IO5 IO6 GND GND IO7 IO8 IO9 IO10 IO11 IO12 IO13 GND 3V3 IO0 IO1 IO2 IO3 IO4 IO5 IO6 IO7 IO8 IO9 IO10 IO11 IO12 IO13 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 EPAD GND EN IO46 IO45 RXD0 TXD0 IO42 IO41 IO40 IO39 IO38 IO37 IO36 IO35 IO34 IO33 32.
7. Physical Dimensions and PCB Land Pattern 7. Physical Dimensions and PCB Land Pattern 7.1 Physical Dimensions Unit: mm Tolerance: +/-0.1 mm 3.30±0.15 1.00 4.00 0.90 0.85 0.85 0.45 0.9 1 1.50 15.45 0.90 1.50 0.50 15.84 2.25 0.50 1.00 19.30 23.10 4.00 2,25 10.19 0.1 10.44 31.00±0.15 0.80 8.35 6.30 18.00±0.15 0.45 Top View Side View Bottom View Figure 7: Physical Dimensions Espressif Systems 21 ESP32-S2-WROOM & ESP32-S2-WROOM-I Datasheet V1.
7. Physical Dimensions and PCB Land Pattern 7.2 Recommended PCB Land Pattern Unit: mm Via for thermal pad Copper 42x1.50 Antenna Area 1 42 42x0.90 4.10 0.40 1.50 0.40 15.45 0.50 0.50 1.10 4.10 31.00 1.10 7.81 1.00 6.30 18.00 17 26 1.50 2.25 Figure 8: Recommended PCB Land Pattern Espressif Systems 22 ESP32-S2-WROOM & ESP32-S2-WROOM-I Datasheet V1.
7. Physical Dimensions and PCB Land Pattern 7.3 U.FL Connector Dimensions Unit: mm Figure 9: U.FL Connector Dimensions Espressif Systems 23 ESP32-S2-WROOM & ESP32-S2-WROOM-I Datasheet V1.
8. Product Handling 8. Product Handling 8.1 Storage Condition The products sealed in Moisture Barrier Bag (MBB) should be stored in a noncondensing atmospheric environment of < 40 °C/90%RH. The module is rated at moisture sensitivity level (MSL) 3. After unpacking, the module must be soldered within 168 hours with factory conditions 25±5 °C and /60%RH. The module needs to be baked if the above conditions are not met. 8.
9. MAC Addresses and eFuse 9. MAC Addresses and eFuse The eFuse in ESP32-S2 has been burnt into 48-bit mac_address. The actual addresses the chip uses in station or AP modes correspond to mac_address in the following way: • Station mode: mac_address • AP mode: mac_address + 1 There are seven blocks in eFuse for users to use. Each block is 256 bits in size and has independent write/read disable controller.
10. Learning Resources 10. Learning Resources 10.1 Must-Read Documents The following link provides documents related to ESP32-S2. • ESP32-S2 Datasheet This document provides an introduction to the specifications of the ESP32-S2 hardware, including overview, pin definitions, functional description, peripheral interface, electrical characteristics, etc. • ESP-IDF Programming Guide It hosts extensive documentation for ESP-IDF ranging from hardware guides to API reference.
Revision History Revision History Date Version Release notes 2020-07-31 V1.1 Updated notes in table 1. 2020-06-01 V1.0 Official release. 2020-03-10 V0.5 Preliminary release. Espressif Systems 27 ESP32-S2-WROOM & ESP32-S2-WROOM-I Datasheet V1.
