Manual
Table Of Contents
- Preface
- Contents
- 1 Hardware description
- 2 Design-in
- 2.1 Power management
- 2.2 Interfaces
- 2.3 I/O Pins
- 2.4 Real-Time Clock (RTC)
- 2.5 RF input
- 2.6 Safe Boot Mode (SAFEBOOT_N)
- 2.7 System Reset (RESET_N)
- 2.8 Pin description
- 2.9 Typical schematic
- 2.10 Design-in checklist
- 2.11 Layout design-in checklist
- 2.12 Layout
- 2.13 EOS/ESD/EMI precautions
- 3 Product handling & soldering
- 4 Product testing
- Appendix
- A Component selection
- B Glossary
- Related documents
- Revision history
- Contact
ZOE-M8 series - Hardware Integration Manual
UBX-16030136 - R07 Production Information Contents
Page 4 of 32
Contents
Preface ................................................................................................................................ 3
Contents .............................................................................................................................. 4
1 Hardware description .................................................................................................. 6
1.1 Overview .............................................................................................................................................. 6
2 Design-in ....................................................................................................................... 6
2.1 Power management ............................................................................................................................. 6
2.1.1 Main supply voltage (VCC) ............................................................................................................ 6
2.1.2 V_CORE (only on ZOE-M8Q) .......................................................................................................... 6
2.1.3 DC/DC converter (only on ZOE-M8Q) ............................................................................................ 7
2.1.4 Backup power supply (V_BCKP) ..................................................................................................... 7
2.2 Interfaces .............................................................................................................................................. 8
2.2.1 UART interface .............................................................................................................................. 8
2.2.2 Display Data Channel (DDC) interface ........................................................................................... 9
2.2.3 SPI interface .................................................................................................................................. 9
2.2.1 SQI interface.................................................................................................................................. 9
2.3 I/O Pins ............................................................................................................................................... 10
2.3.1 Time pulse ................................................................................................................................... 10
2.3.2 External interrupt ........................................................................................................................ 10
2.3.3 External LNA enable .................................................................................................................... 10
2.3.4 Electromagnetic interference and I/O lines ................................................................................... 10
2.4 Real-Time Clock (RTC) ........................................................................................................................ 11
2.4.1 RTC using a crystal ...................................................................................................................... 11
2.4.2 RTC using an external clock ......................................................................................................... 11
2.4.3 Time aiding ................................................................................................................................. 11
2.5 RF input .............................................................................................................................................. 11
2.5.1 Passive antenna ........................................................................................................................... 12
2.5.2 Improved jamming immunity ....................................................................................................... 13
2.5.3 Active antenna ............................................................................................................................ 13
2.6 Safe Boot Mode (SAFEBOOT_N) .......................................................................................................... 13
2.7 System Reset (RESET_N) ...................................................................................................................... 14
2.8 Pin description .................................................................................................................................... 14
2.9 Typical schematic ................................................................................................................................ 16
2.10 Design-in checklist .......................................................................................................................... 18
2.10.1 General considerations ................................................................................................................ 18
2.10.2 Schematic design-in for ZOE-M8 GNSS SiPs ................................................................................. 18
2.11 Layout design-in checklist ............................................................................................................... 18
2.12 Layout ............................................................................................................................................. 19
2.12.1 Footprint ..................................................................................................................................... 19
2.12.2 Paste mask .................................................................................................................................. 20
2.12.3 Placement ................................................................................................................................... 20
2.13 EOS/ESD/EMI precautions ................................................................................................................ 20