Data Sheet

Page 36 ams Datasheet
Document Feedback [v1-00] 2016-Nov-25
AS7263 − Storage & Soldering Information
Soldering Information
The module has been tested and has demonstrated an ability
to be reflow soldered to a PCB substrate. The solder reflow
profile describes the expected maximum heat exposure of
components during the solder reflow process of product on a
PCB. Temperature is measured on top of component. The
components should be limited to a maximum of three passes
through this solder reflow profile.
Figure 38:
Solder Reflow Profile
Figure 39:
Solder Reflow Profile Graph
Note(s):
1. Not to scale - for reference only.
Parameter Reference Device
Average temperature gradient in preheating 2.5°C/s
Soak time
t
soak
2 to 3 minutes
Time above 217°C
t
1
Max 60 s
Time above 230°C
t
2
Max 50 s
Time above T
peak
-10°C t
3
Max 10 s
Peak temperature in reflow
T
peak
260° C
Temperature gradient in cooling Max -5°C/s
Storage & Soldering
Information
t
3
t
2
t
1
t
soak
T
3
T
2
T
1
T
peak
Not to scale — for reference only
Time (s)
Temperature (5C)