Data Sheet

MLX90640 32x24 IR array
Datasheet
Page 59 of 60
REVISION 11 – 3 AUGUST 2018
16. Standard Information
Our products are classified and qualified regarding soldering technology, solderability and moisture sensitivity level
according to standards in place in Semiconductor industry.
For further details about test method references and for compliance verification of selected soldering method for
product integration, Melexis recommends reviewing on our web site the General Guidelines soldering
recommendation. For all soldering technologies deviating from the one mentioned in above document (regarding peak
temperature, temperature gradient, temperature profile etc.), additional classification and qualification tests have to
be agreed upon with Melexis.
For package technology embedding trim and form post-delivery capability, Melexis recommends consulting the
dedicated trim & forming recommendation application note: lead trimming and forming recommendations
Melexis is contributing to global environmental conservation by promoting lead free solutions. For more information
on qualifications of RoHS compliant products (RoHS = European directive on the Restriction Of the use of certain
Hazardous Substances) please visit the quality page on our website: http://www.melexis.com/en/quality-environment
17. ESD Precautions
Electronic semiconductor products are sensitive to Electro Static Discharge (ESD).
Always observe Electro Static Discharge control procedures whenever handling semiconductor products.
18. Revision history table
25/07/2016 Initial release
15/12/2016 Calibration data stored into EEPROM, pixel reading modes explained
17/01/2017 Some errors fixed
07/02/2017 Some calculations errors fixed
24/02/2017 Noise, FOV and accuracy graphs added, some inaccuracies fixed
02/03/2017 Overall rearranged , some typo and grammar mistakes fixed
18/05/2017 Two’s complement for IR data from RAM and CP, added outlier identification in EEPROM , added
application information
07/07/2017 Slave address changed to 0x240F, default mode is chess, CP RAM address changed 0x0709 ->
0x0708 and 0x0729 -> 0x0728, resolution control included in calculations, PCB under TO can
removed
30/08/2017 Laser marking added, Max number of fail pixels added, Measurement flow (continuous and step
mode) added, FOV definitions updated
10/10/2017 Added a note regarding CP averaging. Add dimension tolerances in mechanical drawings. Spelling
errors corrected