Data Sheet
Final Datasheet
BME280 Environmental sensor
Page 5
BST-BME280-DS001-10 | Revision 1.1 | May 2015 Bosch Sensortec
© Bosch Sensortec GmbH reserves all rights even in the event of industrial property rights. We reserve all rights of disposal such as copying and passing on to
third parties. BOSCH and the symbol are registered trademarks of Robert Bosch GmbH, Germany.
Note: Specifications within this document are subject to change without notice.
5.4.1 REGISTER 0XD0 “ID” ..................................................................................................................... 25
5.4.2 REGISTER 0XE0 “RESET” ............................................................................................................... 25
5.4.3 REGISTER 0XF2 “CTRL_HUM” ........................................................................................................ 25
5.4.4 REGISTER 0XF3 “STATUS” ............................................................................................................. 26
5.4.5 REGISTER 0XF4 “CTRL_MEAS” ....................................................................................................... 26
5.4.6 REGISTER 0XF5 “CONFIG” ............................................................................................................. 27
5.4.7 REGISTER 0XXF9 “PRESS” (_MSB, _LSB, _XLSB) ................................................................... 28
5.4.8 REGISTER 0XXFC “TEMP” (_MSB, _LSB, _XLSB).................................................................... 29
5.4.9 REGISTER 0XXFE “HUM” (_MSB, _LSB) ................................................................................ 29
6. DIGITAL INTERFACES ............................................................................................................ 30
6.1 INTERFACE SELECTION ...................................................................................................... 30
6.2 I²C INTERFACE.................................................................................................................. 30
6.2.1 I²C WRITE ..................................................................................................................................... 31
6.2.2 I²C READ ...................................................................................................................................... 31
6.3 SPI INTERFACE ................................................................................................................. 32
6.3.1 SPI WRITE .................................................................................................................................... 33
6.3.2 SPI READ ..................................................................................................................................... 33
6.4 INTERFACE PARAMETER SPECIFICATION ............................................................................. 34
6.4.1 GENERAL INTERFACE PARAMETERS ................................................................................................ 34
6.4.2 I²C TIMINGS .................................................................................................................................. 34
6.4.3 SPI TIMINGS ................................................................................................................................. 35
7. PIN-OUT AND CONNECTION DIAGRAM ............................................................................... 37
7.1 PIN-OUT ........................................................................................................................... 37
7.2 CONNECTION DIAGRAM I
2
C ................................................................................................ 38
7.3 CONNECTION DIAGRAM 4-WIRE SPI ................................................................................... 39
7.4 CONNECTION DIAGRAM 3-WIRE SPI ................................................................................... 40
7.5 PACKAGE DIMENSIONS ...................................................................................................... 41
7.6 LANDING PATTERN RECOMMENDATION ............................................................................... 42
7.7 MARKING .......................................................................................................................... 43
7.7.1 MASS PRODUCTION DEVICES ......................................................................................................... 43
7.7.2 ENGINEERING SAMPLES ................................................................................................................. 44
7.8 SOLDERING GUIDELINES AND RECONDITIONING RECOMMENDATIONS .................................... 45
7.9 RECONDITIONING PROCEDURE .......................................................................................... 46
7.10 TAPE AND REEL SPECIFICATION........................................................................................ 46
7.10.1 DIMENSIONS ............................................................................................................................... 46
7.10.2 ORIENTATION WITHIN THE REEL.................................................................................................... 47
7.11 MOUNTING AND ASSEMBLY RECOMMENDATIONS ............................................................... 48
7.12 ENVIRONMENTAL SAFETY ................................................................................................ 48
7.12.1 ROHS ........................................................................................................................................ 48
7.12.2 HALOGEN CONTENT .................................................................................................................... 48
7.12.3 INTERNAL PACKAGE STRUCTURE .................................................................................................. 48