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BST-BME280-DS001-10 | Revision 1.1 | May 2015 Bosch Sensortec
© Bosch Sensortec GmbH reserves all rights even in the event of industrial property rights. We reserve all rights of disposal such as copying and passing on to
third parties. BOSCH and the symbol are registered trademarks of Robert Bosch GmbH, Germany.
Note: Specifications within this document are subject to change without notice.
7.8 Soldering guidelines and reconditioning recommendations
The moisture sensitivity level of the BME280 sensors corresponds to JEDEC Level 1, see also:
IPC/JEDEC J-STD-020C Joint Industry Standard: Moisture/Reflow Sensitivity
Classification for non-hermetic Solid State Surface Mount Devices
IPC/JEDEC J-STD-033A Joint Industry Standard: Handling, Packing, Shipping and Use of
Moisture/Reflow Sensitive Surface Mount Devices.
The sensor fulfils the lead-free soldering requirements of the above-mentioned IPC/JEDEC
standard, i.e. reflow soldering with a peak temperature up to 260°C. The minimum height of the
solder after reflow shall be at least 50µm. This is required for good mechanical decoupling
between the sensor device and the printed circuit board (PCB).
Figure 22: Soldering profile