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Data Sheet

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BST-BME280-DS001-10 | Revision 1.1 | May 2015 Bosch Sensortec
© Bosch Sensortec GmbH reserves all rights even in the event of industrial property rights. We reserve all rights of disposal such as copying and passing on to
third parties. BOSCH and the symbol are registered trademarks of Robert Bosch GmbH, Germany.
Note: Specifications within this document are subject to change without notice.
7.6 Landing pattern recommendation
For the design of the landing pattern, the following dimensioning is recommended:
Figure 21: Recommended landing pattern (top view)
Note: red areas demark exposed PCB metal pads.
In case of a solder mask defined (SMD) PCB process, the land dimensions should be
defined by solder mask openings. The underlying metal pads are larger than these
openings.
In case of a non solder mask defined (NSMD) PCB process, the land dimensions should
be defined in the metal layer. The mask openings are larger than these metal pads.