Design Guide

Host Board Design
A DIVISION OF TRIMBLE
Hardware Integration 51
The ThingMagic Nano module mounts to the host board via the landing pads. These pads
are at a pitch of 1.25 mm. The intention is for the ThingMagic Nano module is to use
routed-through via connections with 0.7 mm diameter edge vias. The pads of the
ThingMagic Nano module underside should align with the copper pads of the footprint,
with a pad exposure extending outside the M6e-Nano edge be a nominal 0.5 mm. A 0.5
mm keep-out shall surround any non-ground pad. The module pad positional tolerance
shall be not more than +/-0.2 mm to support contact alignment during fixturing.
The circuitry feeding the RF pad of the M6e-Nano shall be optimized for connecting to a
coplanar wave guide with ground plane beneath. The CPW-G will have dimensions as
shown in the following diagram.
The area beneath the module should be kept clear of traces and copper.
In addition to the design and process recommendations, the following should be
considered:
PAD 37, GND
PAD 36, GND
Pad 35, RF
PAD 34, GND
PAD 33, GND
NANO Module Edge
CPW-G with:
50 ohm nominal,
0.44 mm Width,
0.40 mm Gap,
0.254 mm Substrate Thickness
Er = 4.4 Nominal
1 ounce copper , Trace and Ground
PAD CLEARANCE
0.5 mm
PAD Typical
2.0 mm x 0.75 mm
1.25 mm pitch