Datasheet

9.5 Pb-free solder reflow process
Table 17. Recommended solder profile and Figure 25. Solder profile show the recommended and maximum
values for the solder profile.
Customers have to tune the reflow profile depending on the PCB, solder paste and material used. We expect
customers to follow the recommended reflow profile, which is specifically tuned for package.
For any reason, if a customer must perform a reflow profile which is different from the recommended one
(especially peak >240°C), this new profile must be qualified by the customer at their own risk. In any case, the
profile must be within the “maximum” profile limit described in the following table.
Note: Temperature mentioned in the following table are measured at the top of the package.
Table 17. Recommended solder profile
Parameters Recommended Maximum Unit
Minimum temperature (TS min) 130 150
°C
Maximum temperature (TS max) 200 200
Time ts (TS min to TS max) 90-110 60-120 s
Temperature (TL) 217 217 °C
Time (tL) 55-65 55-65 s
Ramp up 2 3 °C/s
Temperature (Tp-10)
-
250 °C
Time (tp-10) 10 s
Ramp up 3 °C/s
Peak temperature (Tp) 240 260 max °C
Time to peak 30 300 s
Ramp down (peak to Tl) -4 -6 °C/s
Figure 25. Solder profile
Note: The component should be limited to a maximum of three passes through this solder profile.
Note: As the VL53L4CD package is not sealed, only a dry reflow process should be used (such as convection reflow).
Vapor phase reflow is not suitable for this type of optical component.
Note: The VL53L4CD is an optical component and as such, it should be treated carefully. This would typically include
using a ‘no wash’ assembly process.
VL53L4CD
Pb-free solder reflow process
DS13812 - Rev 3
page 29/36