Datasheet

www.sensirion.com
Version 1.0 – July 2020 – D1
16/19
5.3 Land Pattern
Recommended land pattern of the SGP40 is shown in Figure 13. Pads on PCB are recommended to be non-solder mask
defined (NSMD). Recommended solder paste stencil thickness is 125–150 m.
Figure 13 Recommended land pattern.
5.4 Soldering Instructions
Standard reflow soldering ovens and “no clean” type 3 solder paste (as specified in IPC J-STD-005A) should be used for
soldering the SGP40. The sensors are designed to withstand a soldering profile according to IPC/JEDEC J-STD-020. Peak
temperatures of T
P
= 245 °C during up to t
p
= 30 s for Pb-free assembly in IR/Convection reflow ovens (see Figure 14) are
recommended. In addition, we also recommend a maximum ramp-down rate of <4 °C s
−1
. Vapor phase or manual soldering
should not be used in order to avoid damaging of the sensor. In case the PCB hosting the SGP40 chip passes through multiple
solder cycles, it is recommended to assemble the SGP40 during the last solder cycle. Board wash and ultrasonic cleaning should
be avoided. For general information (such as conformal coating), please also refer to the Handling and Assembly Instructions
for SGPxx Gas Sensors.
Figure 14 Soldering profile according to JEDEC standard. Recommended
conditions are T
P
= 245°C and t
P
≤ 30 s for Pb-free assembly, T
L
< 220°C
and t
L
< 150 s. Ramp-up rate <3°C s
−1
and ramp-down rate <4°C s
−1
.