Datasheet

www.sensirion.com
Version 1.0 – July 2020 – D1
15/19
5 Mechanical Specifications
SGP40 sensors are provided in a DFN (dual flat no leads) package with an outline of 2.44 × 2.44× 0.85 mm
3
and a terminal pitch
of 0.8 mm. The sensor opening with a typical diameter of 0.8 mm is offset to the bottom right corner on the top side of the
package. The sensor chip is assembled on a Ni/Pd/Au plated copper lead frame. Sensor chip and lead frame are over-molded
by a black, epoxy-based mold compound. Please note that the side walls of the package are diced and therefore the lead frame
sidewall surfaces are not plated.
5.1 Traceability
All SGP40 sensors are laser marked for easy identification and traceability (Figure 11). The marking on the sensor top side
consists of a pin-1 indicator and three lines of text. The top line consists of the pin-1 indicator which is located in the top left
corner and the product name. The two lines at the bottom consist of 2 alphanumeric digits each. That code can be decoded by
Sensirion only and allows for tracking on batch level through production, calibration, and testing – and will be provided upon
justified request.
If viewed from below pin 1 is indicated by triangular shaped cut in the otherwise rectangular die pad. The dimensions of the
triangular cut are shown in Figure 12, right. The sensor opening on the top side is not recommended for optical alignment.
Figure 11 Top view of the SGP40
illustrating the laser marking.
5.2 Package Outline
Figure 12 Package outline drawing of the SGP40. Dimensions are given in millimeters.