Datasheet

Table Of Contents
7.2 LSM6DSO electrical connections in Mode 2
Figure 22. LSM6DSO electrical connections in Mode 2
Vdd_IO
GND
100 nF
C2
SDO/SA0
MSDA
MSCL
INT1
GND
VDDIO
CS
SCL
SDA
11
5
7
12
TOP
VIEW
VDD
NC
NC
14
8
4
Vdd
GND
100 nF
C1
MDRDY/INT2
GND
1
HOST
LSM6DSO
LSM6DSM
LSM6DSM
External
sensors
Master I
2
C
Mode 2
SCL
SDA
Vdd_IO
R
pu
R
pu
Pull-up to be added
R
pu
=10kOhm
I
2
C configuration
(1)
(1)
I
2
C
SPI (3/4-w)
/
MIPI I3C
SM
/
1. Leave pin electrically unconnected and soldered to PCB.
The device core is supplied through the Vdd line. Power supply decoupling capacitors (C1, C2 = 100 nF ceramic)
should be placed as near as possible to the supply pin of the device (common design practice).
The functionality of the device and the measured acceleration/angular rate data is selectable and accessible
through the SPI/I²C/MIPI I3C
SM
primary interface.
The functions, the threshold and the timing of the two interrupt pins for each sensor can be completely
programmed by the user through the SPI/I²C/MIPI I3C
SM
primary interface.
LSM6DSO
LSM6DSO electrical connections in Mode 2
DS12140 - Rev 2
page 36/172