Datasheet

Table Of Contents
7 Application hints
7.1 LSM6DSO electrical connections in Mode 1
Figure 21. LSM6DSO electrical connections in Mode 1
GND or VDDIO
Vdd_IO
GND
100 nF
C2
SDO/SA0
SDx
SCx
INT1
GND
VDDIO
CS
SCL
SDA
11
5
7
12
TOP
VIEW
VDD
INT2
NC
NC
14
8
4
Vdd
GND
100 nF
C1
GND
1
SCL
SDA
Vdd_IO
R
pu
R
pu
Pull-up to be added
R
pu
=10kOhm
I
2
C configuration
HOST
LSM6DSO
I
2
C
SPI (3/4-w)
Mode 1
(1)
(1)
/
MIPI I3C
SM
/
1. Leave pin electrically unconnected and soldered to PCB.
The device core is supplied through the Vdd line. Power supply decoupling capacitors (C1, C2 = 100 nF ceramic)
should be placed as near as possible to the supply pin of the device (common design practice).
The functionality of the device and the measured acceleration/angular rate data is selectable and accessible
through the SPI/I²C/MIPI I3C
SM
interface.
The functions, the threshold and the timing of the two interrupt pins for each sensor can be completely
programmed by the user through the SPI/I²C/MIPI I3C
SM
interface.
LSM6DSO
Application hints
DS12140 - Rev 2
page 35/172