Datasheet

1 Overview
The LSM6DSO is a system-in-package featuring a high-performance 3-axis digital accelerometer and 3-axis
digital gyroscope.
The LSM6DSO delivers best-in-class motion sensing that can detect orientation and gestures in order to
empower application developers and consumers with features and capabilities that are more sophisticated than
simply orienting their devices to portrait and landscape mode.
The event-detection interrupts enable efficient and reliable motion tracking and contextual awareness,
implementing hardware recognition of free-fall events, 6D orientation, click and double-click sensing, activity or
inactivity, stationary/motion detection and wakeup events.
The LSM6DSO supports main OS requirements, offering real, virtual and batch mode sensors. In addition, the
LSM6DSO can efficiently run the sensor-related features specified in Android, saving power and enabling faster
reaction time. In particular, the LSM6DSO has been designed to implement hardware features such as significant
motion detection, stationary/motion detection, tilt, pedometer functions, timestamping and to support the data
acquisition of an external magnetometer.
The LSM6DSO offers hardware flexibility to connect the pins with different mode connections to external sensors
to expand functionalities such as adding a sensor hub, auxiliary SPI, etc.
Up to 9 kbytes of FIFO with compression and dynamic allocation of significant data (i.e. external sensors,
timestamp, etc.) allows overall power saving of the system.
Like the entire portfolio of MEMS sensor modules, the LSM6DSO leverages the robust and mature in-house
manufacturing processes already used for the production of micromachined accelerometers and gyroscopes. The
various sensing elements are manufactured using specialized micromachining processes, while the IC interfaces
are developed using CMOS technology that allows the design of a dedicated circuit which is trimmed to better
match the characteristics of the sensing element.
The LSM6DSO is available in a small plastic land grid array (LGA) package of 2.5 x 3.0 x 0.83 mm to address
ultra-compact solutions.
LSM6DSO
Overview
DS12140 - Rev 2
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