Datasheet

Bosch Sensortec | BME680 Datasheet
46 | 50
Modifications reserved |Data subject not change without notice | Printed in Germany
Document number: BST-BME680-DS001-00 Revision_1.0_072017
7.6 Soldering guidelines and reconditioning recommendations
The moisture sensitivity level of the BME680 sensors corresponds to JEDEC Level 1, see also:
 IPC/JEDEC J-STD-020C “Joint Industry Standard: Moisture/Reflow Sensitivity Classification for non-hermetic Solid
State Surface Mount Devices”
 IPC/JEDEC J-STD-033A “Joint Industry Standard: Handling, Packing, Shipping and Use of Moisture/Reflow
Sensitive Surface Mount Devices”
The sensor fulfils the lead-free soldering requirements of the above-mentioned IPC/JEDEC standard, i.e. reflow soldering
with a peak temperature up to 260°C. The minimum height of the solder after reflow shall be at least 50 µm. This is required
for good mechanical decoupling between the sensor device and the printed circuit board (PCB).
Picture 15: Soldering profile
7.7 Mounting and assembly recommendations
This HSMI-document provides all the necessary instructions to handle, solder and mount the environmental sensor BME680.
Following the reported guidelines is very important to prevent the damage of the sensor and the resultant loss of warranty.