Datasheet

Bosch Sensortec | BME680 Datasheet
44 | 50
Modifications reserved |Data subject not change without notice | Printed in Germany
Document number: BST-BME680-DS001-00 Revision_1.0_072017
7.4 Landing pattern recommendation
For the design of the landing pattern, the dimensions shown in Picture 14: Recommended landing pattern (top view;
dimensions are in milli-meters) are recommended. It is important to note that areas marked in red are exposed PCB metal
pads.
 In case of a solder mask defined (SMD) PCB process, the land dimensions should be defined by solder mask
openings. The underlying metal pads are larger than these openings.
 In case of a non-solder mask defined (NSMD) PCB process, the land dimensions should be defined in the metal
layer. The mask openings are larger than these metal pads.
1
2
4
3
8
7
5
6
Soldier stop
Landing pattern
1.50
3.00
0.40 0.60
0.20
0.40
0.60
1.50
3.00
0.10
Picture 14: Recommended landing pattern (top view; dimensions are in milli-meters)