Data Sheet

Bosch Sensortec | BME280 Data sheet
45 | 55
Modifications reserved | Data subject to change without notice
Document number: BST-BME280-DS002-15
Revision_1.6_092018
7.8 Soldering guidelines and reconditioning recommendations
The moisture sensitivity level of the BME280 sensors corresponds to JEDEC Level 1, see also:
 IPC/JEDEC J-STD-020C “Joint Industry Standard: Moisture/Reflow Sensitivity Classification for
non-hermetic Solid State Surface Mount Devices”
 IPC/JEDEC J-STD-033A “Joint Industry Standard: Handling, Packing, Shipping and Use of
Moisture/Reflow Sensitive Surface Mount Devices”.
The sensor fulfils the lead-free soldering requirements of the above-mentioned IPC/JEDEC standard,
i.e. reflow soldering with a peak temperature up to 260°C. The minimum height of the solder after
reflow shall be at least 50µm. This is required for good mechanical decoupling between the sensor
device and the printed circuit board (PCB).
Figure 22: Soldering profile