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ManualsBrandsSparkFun Electronics ManualsDevelopment Boards & KitsVEML6030 Ambient Light Sensor Breakout
567891011121314
VEML6030
www.vishay.com
Vishay Semiconductors
Rev. 1.3, 12-May-17
13
Document Number: 84366
For technical questions, contact: sensorstechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Fig. 13 - Taping
REFLOW SOLDER PROFILE
Fig. 14 - Lead (Pb)-free Reflow Solder Profile
According to J-STD-020
DRYPACK
Devices are packed in moisture barrier bags (MBB) to
prevent the products from moisture absorption during
transportation and storage. Each bag contains a desiccant.
FLOOR LIFE
Floor life (time between soldering and removing from MBB)
must not exceed the time indicated on MBB label:
Floor life: 72 h
Conditions: T
amb
< 30 °C, RH < 60 %
Moisture sensitivity level 4, according to J-STD-020.
DRYING
In case of moisture absorption devices should be baked
before soldering. Conditions see J-STD-020 or label.
Devices taped on reel dry using recommended conditions
192 h at 40 °C (+ 5 °C), RH < 5 %.
Drawing-No.: 9.700-5397.01-4
Issue: 1; 19.02.16
technical drawings
according to DIN
specications
PIN 1
(8)
(1.75)(3.5)
(2.3)
(4)
(Ø 1)
(Ø 1.5)
(4)
(2)
Reel off direction
Y
Y
(0.25)
(2.3)
(1.25)
Y - Y