Data Sheet

ICM-20948
Document Number: DS-000189 Page 20 of 89
Revision: 1.3
4.2 TYPICAL OPERATING CIRCUIT
AUX_CL
VDDIO
SDO
/ AD0
REGOUT
FSYNC
INT1
GND
SCL / SCLK
nCS
RESV
VDD
SDA / SDI
NC
1
.71 – 3.6VDC
C2, 0.1 µF
C3, 0.1 µ F
1.71 – 1.95VDC
SCL
VDDIO
SDA
AUX_DA
AD0
C1, 0.1 µF
RESV
NC
NC
NC
NC
NC
NC
NC
NC
NC
ICM
-20948
1
2
3
4
5
6
13
18
17
16
15
14
7
8
9
10
11
12
24
23
22
21
20
19
AUX_CL
VDDIO
SDO
/ AD0
REGOUT
FSYNC
INT1
GND
SCL / SCLK
nCS
RESV
VDD
SDA / SDI
NC
1
.71 – 3.6VDC
C2, 0.1 µF
C3, 0.1 µ F
1.71 – 1.95VDC
SCLK
SDI
AUX_DA
SDO
C1, 0.1 µF
RESV
NC
NC
NC
NC
NC
NC
NC
NC
NC
ICM
-20948
1
2
3
4
5
6
13
18
17
16
15
14
7
8
9
10
11
12
24
23
22
21
20
19
nCS
(a) (b)
Figure 4. ICM-20948 Application Schematic (a) I
2
C operation (b) SPI operation
Note that the INT pin should be connected to a GPIO pin on the system processor that is capable of waking the system
processor from suspend mode.
I
2
C lines are open drain and pullup resistors (e.g. 10 kΩ) are required.
4.3 BILL OF MATERIALS FOR EXTERNAL COMPONENTS
COMPONENT LABEL SPECIFICATION QUANTITY
Regulator Filter Capacitor C1 Ceramic, X7R, 0.1 µF ±10%, 2V 1
VDD Bypass Capacitor C2 Ceramic, X7R, 0.1 µF ±10%, 4V 1
VDDIO Bypass Capacitor C3 Ceramic, X7R, 0.1 µF ±10%, 4V 1
Table 11. Bill of Materials
4.4 EXPOSED DIE PAD PRECAUTIONS
InvenSense products have very low active and standby current consumption. The exposed die pad is not required for
heat sinking, and should not be soldered to the PCB. Failure to adhere to this rule can induce performance changes
due to package thermo-mechanical stress. There is no electrical connection between the pad and the CMOS.