Data Sheet

ICM-20948
World’s Lowest Power 9-Axis MEMS MotionTracking™ Device
InvenSense reserves the right to change the detail
specifications as may be required to permit
improvements in the design of its products.
TDK Corporation
1745 Technology Drive, San Jose, CA 95110 U.S.A
+1(408) 9887339
www.invensense.com
Document Number: DS-000189
Revision: 1.3
Release Date: 06/02/2017
GENERAL DESCRIPTION
The ICM-20948 is the world’s lowest power 9-axis
MotionTracking device that is ideally suited for Smartphones,
Tablets, Wearable Sensors, and IoT applications.
3-axis gyroscope, 3-axis accelerometer, 3-axis
compass, and a Digital Motion Processor™ (DMP
TM
)
in a 3 mm x 3 mm x 1 mm (24-pin QFN) package
DMP offloads computation of motion processing
algorithms from the host processor, improving
system power performance
Software drivers are fully compliant with Google’s
latest Android release
EIS FSYNC support
ICM-20948 supports an auxiliary I
2
C interface to external
sensors, on-chip 16-bit ADCs, programmable digital filters, an
embedded temperature sensor, and programmable
interrupts. The device features an operating voltage range
down to 1.71V. Communication ports include I
2
C and high
speed SPI at 7 MHz.
Note: ICM-20948 VDDIO range is 1.71V to 1.95V, different
than the MPU-9250 9-axis device.
ORDERING INFORMATION
PART
TEMP RANGE
PACKAGE
ICM-20948† −40°C to +85°C 24-Pin QFN
Denotes RoHS and Green-Compliant Package
BLOCK DIAGRAM
APPLICATIONS
Smartphones and Tablets
Wearable Sensors
IoT Applications
FEATURES
Lowest Power 9-Axis Device at 2.5 mW
3-Axis Gyroscope with Programmable FSR of
±250 dps, ±500 dps, ±1000 dps, and ±2000 dps
3-Axis Accelerometer with Programmable FSR of
±2g, ±4g, ±8g, and ±16g
3-Axis Compass with a wide range to ±4900 µT
Onboard Digital Motion Processor (DMP)
Android support
Auxiliary I
2
C interface for external sensors
On-Chip 16-bit ADCs and Programmable Filters
7 MHz SPI or 400 kHz Fast Mode I²C
Digital-output temperature sensor
VDD operating range of 1.71V to 3.6V
MEMS structure hermetically sealed and bonded at
wafer level
RoHS and Green compliant
TYPICAL OPERATING CIRCUIT
AUX_CL
VDDIO
SDO
/ AD0
REGOUT
FSYNC
INT1
GND
SCL / SCLK
nCS
RESV
VDD
SDA / SDI
NC
1
.71 – 3.6VDC
C2, 0.1 µF
C3, 0.1 µ F
1.71 – 1.95VDC
SCLK
SDI
AUX_DA
SDO
C1, 0.1 µF
RESV
NC
NC
NC
NC
NC
NC
NC
NC
NC
ICM
-20948
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nCS

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