Datasheet

5.6 Mechanical Dimensions
5.6.1 6-pin SOT23-6
DRAWING NO. REV. TITLE
GPC
6ST1 B
1/25/13
TAQ
Package Drawing Contact:
[e-mail]
Notes: 1. This package is compliant with JEDEC specification
MO-178 Variation AB.
2. Dimension D does not include mold Flash, protrusions or
gate burrs. Mold Flash, protrustion or gate burrs shall not
exceed 0.25 mm per end.
3. Dimension b does not include dambar protrusion.
Allowable dambar protrusion shall not cause the lead width
to exceed the maximum b dimension by more than 0.08 mm
4. Die is facing down after trim/form.
MAX
NOTE
SYMBOL
MIN
NOM
COMMON DIMENSIONS
(Unit of Measure = mm)
A – – 1.45
A1 0 – 0.15
A2 0.90 – 1.30
D 2.80 2.90 3.00 2
E 2.60 2.80 3.00
E1 1.50 1.60 1.75
L 0.30 0.45 0.55
e 0.95 BSC
b 0.30 – 0.50 3
c 0.09 – 0.20
q 0° – 8°
Side View
E E1
D
e
A2
A
A1
C
C
0.10
0.25
L
O
A2
A
A1
C
C
0.10
A
A
SEE VIEW B
C
SEATING PLANE
SEATING PLANE
SEATING PLANE
c
b
Pin #1 ID
1
6
2
3
5
4
Top View
View B
View A-A
6ST1, 6-lead, 2.90 x 1.60 mm Plastic Small Outline
Package (SOT23)
Note: For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging
AT42QT1011
© 2017 Microchip Technology Inc.
Datasheet
DS40001947A-page 21