User Manual

ThingMagic Nano User Guide 22
www.JADAKtech.com
Landing Pad and Heat-Sink Areas
Hardware design files are available on the web site for the “carrier board” that implements this layout.
ThingMagic Nano module mounts to the host board via the landing pads. These pads are at a pitch of 1.25
mm. The intention is for the ThingMagic Nano module to use routed-through via connections with 0.7 mm
diameter edge vias. The pads of the ThingMagic Nano module underside should align with the copper pads
of the footprint, with a pad exposure extending outside the Nano edge be a nominal 0.5 mm. A 0.5 mm
keep-out shall surround any non-ground pad. The module pad positional tolerance shall be not more than
+/-0.2 mm to support contact alignment during fixturing.
The circuitry feeding the RF pad of the Nano shall be optimized for connecting to a coplanar wave guide
with ground plane beneath. For pad and trace dimensions, refer to the document Advice for Carrier Board
Layout, downloadable from the website.
The area beneath the module should be kept clear of traces and copper.
In addition to the design and process recommendations, the following should be considered: