User Manual

ThingMagic Nano User Guide 21
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Unnecessary long exposure and exposure to more than 245°C should be avoided.
To not overstress the assembly, the complete reflow profile should be as short as possible. An optimization
considering all components on the application must be performed. The optimization of a reflow profile is a
gradual process. It needs to be performed for every paste, equipment and product combination. The
presented profiles are only samples and valid for the used pastes, reflow machines and test application
boards. Therefore a "ready to use" reflow profile cannot be given.
SMT Reflow Profile
There must be only be one reflow cycle, maximum.
Hardware Integration
ThingMagic Nano can integrate with other systems to create RFID-enabled products. This chapter
discusses requirements for a host board design and characteristics of the Nano Carrier Board offered in the
Development Kit and for applications where standard connectors are required to interface the module with
a host board.
Host Board Design
Landing Pads
The following diagram shows the position and recommended size of the landing pads (in dark green) and
the heat-sink areas (in light green).