User Manual

HMC6343
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PACKAGE OUTLINES
PACKAGE DRAWING HMC6343 (32-PIN LPCC, dimensions in millimeters)
Dimensions (mm) Minimum Nominal Maximum
A (height) 1.73 1.87 2.02
D - 9.00 BSC -
D1 - 6.40 BSC -
E - 9.00 BSC -
E1 - 6.40 BSC -
e - 0.8 Basic -
MOUNTING CONSIDERATIONS
The following is the recommend printed circuit board (PCB) footprint for the HMC6343. All dimensions are nominal and in
millimeters.
Stencil Design and Solder Paste
A 4-6 mil stencil and 100% paste coverage is recommended for the electrical contact pads. The HMC6343 has been
assembled successfully with no-clean solder paste.
.
0.34±0.03
D
0.57±0.03
0.10±0.08
E
e
E1
D1
Pin 1
Bottom View
0.34±0.03
D
0.57±0.03
0.10±0.08
E
e
E1
D1
Pin 1
Bottom View