Datasheet

Table Of Contents
DA7280
LRA/ERM Haptic Driver with Multiple Input Triggers,
Integrated Waveform Memory and Wideband Support
Datasheet
Revision 3.0
30-Jul-2019
CFR0011-120-00
75 of 76
© 2019 Dialog Semiconductor
10 Layout Guidelines
For optimal layout, place the 100 nF capacitor as close to VDD and GND_1 pins as possible. It is
also advisable to use solid a ground plane under the device.
The QFN can be routed out on a single layer. It is recommended to connect GND_1 and GND_2 to a
local ground plane on the top layer with a low-impedance via connection to the main ground plane,
see Figure 43.
nIRQ
VIAVIA VIAVIA
VIAVIA
VIA TO
VDD
LAYER
VIA TO GND LAYER
SOLID GND
CONNECTION
ON TOP LAYER
VIA TO
VDDIO
LAYER
100 nF Capacitor
0201 (0603)
SCL SDA
GPI_1
GPI_2 VDDIO
GPI_0/
PWM
OUTN GND_2
VDD OUTP GND_1
Figure 42: WLCSP Example PCB Layout
VIAVIA
VIAVIA
VIAS TO
GND LAYER
SOLID GND
CONNECTION
ON TOP LAYER
VIA TO
VDDIO
LAYER
100 nF Capacitor
0603 (1608)
VIA
VIA
nIRQ SCL SDA
VDDIO
OUTN
GND_1
GND_2
OUTPVDD
GPI_2
GPI_1
GPI_0/PWM
Figure 43: QFN Example PCB Layout