Datasheet
Table Of Contents
- General Description
- Key Features
- Applications
- System Diagrams
- Contents
- Figures
- Tables
- Legal
- Product Family
- 1 Terms and Definitions
- 2 Block Diagram
- 3 Pinout
- 4 Characteristics
- 5 Functional Description
- 5.1 Features Description
- Driving LRA and ERM Actuators
- Automatic LRA Resonant Frequency Tracking
- Wideband LRA Support
- I2C and PWM Input Streaming
- Low Latency I2C/GPI Wake-Up from IDLE State
- Three GPI Sequence Triggers for up to Six Independent Haptic Responses
- On-Board Waveform Memory with Amplitude, Time, and Frequency Control
- Active Acceleration and Rapid Stop for High-Fidelity Haptic Feedback
- Continuous Actuator Diagnostics and Fault Handling
- No Software Requirements with Embedded Operation
- Differential Output Drive
- Current Driven System
- Configurable EMI Suppression
- Automatic Short Circuit Protection
- Ultra-Low Power Consumption with State Retention
- Ultra-Low Latency in STANDBY State
- Supply Monitoring, Reporting, and Automatic Output Limiting
- Open- and Closed-Loop Modes
- Open-Loop Sine/Custom Wave Drive Support
- Small Solution Footprint
- Additional Features
- 5.2 Functional Modes
- 5.3 Resonant Frequency Tracking
- 5.4 Active Acceleration and Rapid Stop
- 5.5 Wideband Frequency Control
- 5.6 Device Configuration and Playback
- 5.7 Advanced Operation
- 5.7.1 Frequency Tracking
- 5.7.2 Rapid Stop
- 5.7.3 Initial Impedance Update
- 5.7.4 Amplitude PID
- 5.7.5 Wideband Operation
- 5.7.6 Custom Waveform Operation
- 5.7.7 Embedded Operation
- 5.7.8 Polarity Change Reporting for Half-Period Control in DRO Mode
- 5.7.9 Loop Filter Configuration
- 5.7.10 UVLO Threshold
- 5.7.11 Edge Rate Control
- 5.7.12 Double Output Current Range
- 5.7.13 Supply Monitoring, Reporting, and Automatic Output Limiting
- 5.7.14 BEMF Fault Limit
- 5.7.15 Increasing Impedance Detection Accuracy
- 5.7.16 Frequency Pause during Rapid Stop
- 5.7.17 Frequency Pause during Rapid Stop
- 5.7.18 Coin ERM Operation
- 5.8 Waveform Memory
- 5.9 General Data Format
- 5.10 I2C Control Interface
- 5.1 Features Description
- 6 Register Overview
- 7 Package Information
- 8 Ordering Information
- 9 Application Information
- 10 Layout Guidelines
DA7280
LRA/ERM Haptic Driver with Multiple Input Triggers,
Integrated Waveform Memory and Wideband Support
Datasheet
Revision 3.0
30-Jul-2019
CFR0011-120-00
13 of 76
© 2019 Dialog Semiconductor
4.5 Thermal Characteristics
Table 10: WLCSP Thermal Ratings
Parameter
Description (Note 1)
Min
Typ
Max
Unit
R
ƟJA
Junction-to-ambient thermal resistance
90.3
°C/W
R
ƟJC_TOP
Junction-to-case (top) thermal resistance
43.6
°C/W
R
ƟJB
Junction-to-board thermal resistance
49.0
°C/W
JT
Junction-to-top characterization parameter
6.4
°C/W
JB
Junction-to-board characterization parameter
45.8
°C/W
Note 1 Multilayer JEDEC standard, still air, ambient temperature 25 °C, simulated value.
Table 11: QFN Thermal Ratings
Parameter
Description (Note 1)
Min
Typ
Max
Unit
R
ƟJA
Junction-to-ambient thermal resistance
88.2
°C/W
R
ƟJC_TOP
Junction-to-case (top) thermal resistance
54.6
°C/W
R
ƟJB
Junction-to-board thermal resistance
39.3
°C/W
JT
Junction-to-top characterization parameter
3.4
°C/W
JB
Junction-to-board characterization parameter
50.0
°C/W
R
ƟJC_BOTTOM
Junction-to-case (bottom) thermal resistance
4.4
°C/W
Note 1 Multilayer JEDEC standard, still air, ambient temperature 25 °C, simulated value.