Datasheet
Table Of Contents
- General Description
- Key Features
- Applications
- System Diagrams
- Contents
- Figures
- Tables
- Legal
- Product Family
- 1 Terms and Definitions
- 2 Block Diagram
- 3 Pinout
- 4 Characteristics
- 5 Functional Description
- 5.1 Features Description
- Driving LRA and ERM Actuators
- Automatic LRA Resonant Frequency Tracking
- Wideband LRA Support
- I2C and PWM Input Streaming
- Low Latency I2C/GPI Wake-Up from IDLE State
- Three GPI Sequence Triggers for up to Six Independent Haptic Responses
- On-Board Waveform Memory with Amplitude, Time, and Frequency Control
- Active Acceleration and Rapid Stop for High-Fidelity Haptic Feedback
- Continuous Actuator Diagnostics and Fault Handling
- No Software Requirements with Embedded Operation
- Differential Output Drive
- Current Driven System
- Configurable EMI Suppression
- Automatic Short Circuit Protection
- Ultra-Low Power Consumption with State Retention
- Ultra-Low Latency in STANDBY State
- Supply Monitoring, Reporting, and Automatic Output Limiting
- Open- and Closed-Loop Modes
- Open-Loop Sine/Custom Wave Drive Support
- Small Solution Footprint
- Additional Features
- 5.2 Functional Modes
- 5.3 Resonant Frequency Tracking
- 5.4 Active Acceleration and Rapid Stop
- 5.5 Wideband Frequency Control
- 5.6 Device Configuration and Playback
- 5.7 Advanced Operation
- 5.7.1 Frequency Tracking
- 5.7.2 Rapid Stop
- 5.7.3 Initial Impedance Update
- 5.7.4 Amplitude PID
- 5.7.5 Wideband Operation
- 5.7.6 Custom Waveform Operation
- 5.7.7 Embedded Operation
- 5.7.8 Polarity Change Reporting for Half-Period Control in DRO Mode
- 5.7.9 Loop Filter Configuration
- 5.7.10 UVLO Threshold
- 5.7.11 Edge Rate Control
- 5.7.12 Double Output Current Range
- 5.7.13 Supply Monitoring, Reporting, and Automatic Output Limiting
- 5.7.14 BEMF Fault Limit
- 5.7.15 Increasing Impedance Detection Accuracy
- 5.7.16 Frequency Pause during Rapid Stop
- 5.7.17 Frequency Pause during Rapid Stop
- 5.7.18 Coin ERM Operation
- 5.8 Waveform Memory
- 5.9 General Data Format
- 5.10 I2C Control Interface
- 5.1 Features Description
- 6 Register Overview
- 7 Package Information
- 8 Ordering Information
- 9 Application Information
- 10 Layout Guidelines
DA7280
LRA/ERM Haptic Driver with Multiple Input Triggers,
Integrated Waveform Memory and Wideband Support
Datasheet
Revision 3.0
30-Jul-2019
CFR0011-120-00
10 of 76
© 2019 Dialog Semiconductor
4 Characteristics
4.1 Absolute Maximum Ratings
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to
the device. These are stress ratings only, so functional operation of the device at these or any other
conditions beyond those indicated in the operational sections of the specification are not implied.
Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability.
Table 4: Absolute Maximum Ratings
Parameter
Description
Conditions
Min
Max
Unit
V
DD
Haptics power supply
Referenced to GND
-0.3
6
V
V
DDIO
Haptics IO supply
-0.3
6
V
V
OUTN
Haptic driver negative output
-0.3
6
V
V
OUTP
Haptic driver positive output
-0.3
6
V
V
nIRQ
Interrupt request line to host
-0.3
6
V
V
SCL
I
2
C clock input
-0.3
6
V
V
SDA
I
2
C data input/output
-0.3
6
V
V
GPI
General purpose inputs
-0.3
6
V
T
A
Operating ambient
temperature
-40
85
°C
T
J
Operating junction
temperature
-40
125
°C
T
STG
Storage temperature
-65
150
°C
ESD
HBM
ESD protection
Human Body Model (HBM)
All non-exposed pins
4
kV
ESD
CDM
ESD protection
Charged Device Model
(CDM)
1
kV
4.2 Recommended Operating Conditions
Unless otherwise noted, the parameters listed in Table 5 are valid for T
A
= 25 ºC, V
DD
= 3.8 V, and
V
DDIO
= 1.8 V.
Table 5: Recommended Operating Conditions
Parameter
Description
Conditions
Min
Typ
Max
Unit
V
DD
Haptics power supply
(battery or regulated rail)
2.8
3.8
5.5
V
V
DDIO
Haptics IO supply (Note 1)
1.35
1.8
5.5
V
Z
LD
Load impedance
4
50
Ω
C
LD
Capacitance to ground on
OUTP and OUTN
1
nF
f
LRA
LRA resonant frequency
Frequency tracking enabled
50
300
Hz
f
LRA_OL
LRA resonant frequency,
open-loop
Frequency tracking disabled
25
1000
Hz
Note 1 During device operation V
DDIO
must be ≤ V
DD
if GPI_0, GPI_1, and GPI_2 are not grounded.