Data Sheet

MCP73831/2
DS20001984G-page 24  2005-2014 Microchip Technology Inc.
APPENDIX A: REVISION HISTORY
Revision G (July 2014)
The following is the list of modifications:
1. Updated the“DC Characteristics” table.
2. Added Section 6.1.1.2 “Input Overvoltage
Protection (IOVP)”.
Revision F (June 2013)
The following is the list of modifications:
3. Updated the Functional Block Diagram.
4. Added the Battery Detection parameter and
related information in the“DC Characteristics”
table.
5. Added new section Section 4.2 “Battery
Detection”.
6. Minor grammatical and spelling corrections.
Revision E (September 2008)
The following is the list of modifications:
1. Package Types: Changed DFN pinout diagram.
2. Section 1.0 “Electrical Characteristics”:
Changed “Charge Impedance Range from
20 k to 67 k
3. Section 1.0 “Electrical Characteristics”:
Misc. Formatting changes.
4. Section 2.0 “Typical Performance Curves”:
Updated Figure 2-4.
5. Section 3.0 “Pin Description”: Added
Exposed Pad pin to table and added
Section 3.6 “Exposed Thermal Pad (EP)”.
6. Updated Appendix A: “Revision History”
7. Added Land Pattern Package Outline Drawing
for 2x3 DFN package.
Revision D (April 2008)
The following is the list of modifications:
1. Changed Charge Termination Current Ratio to
8.5% minimum and 11.5% maximum.
Revision C (October 2007)
The following is the list of modifications:
1. Numerous edits throughout document.
2. Added note to the Temperature Specifications
table.
3. Updated Figure 2-4.
Revision B (March 2006)
The following is the list of modifications:
1. Added MCP73832 through document.
Revision A (November 2005)
Original Release of this Document.