Data Sheet

bq24072 , bq24073 , bq24074 , bq24075 , bq24079
www.ti.com SLUS810K –SEPTEMBER 2008–REVISED MARCH 2015
8.3 Recommended Operating Conditions
MIN MAX UNIT
IN voltage range 4.35 26 V
V
I
’72, ’73, ‘75, '79 4.35 6.4
IN operating voltage range V
‘74 4.35 10.2
I
IN
Input current, IN pin 1.5 A
I
OUT
Current, OUT pin 4.5 A
I
BAT
Current, BAT pin (Discharging) 4.5 A
I
CHG
Current, BAT pin (Charging) 1.5
(1)
A
T
J
Junction Temperature –40 125 °C
R
ILIM
Maximum input current programming resistor 1100 8000 Ω
R
ISET
Fast-charge current programming resistor
(2)
590 8900 Ω
R
ITERM
Termination current programming resistor 0 15 kΩ
R
TMR
Timer programming resistor 18 72 kΩ
(1) The IC operational charging life is reduced to 20,000 hours, when charging at 1.5A and 125°C. The thermal regulation feature reduces
charge current if the IC’s junction temperature reaches 125°C; thus without a good thermal design the maximum programmed charge
current may not be reached.
(2) Use a 1% tolerance resistor for R
ISET
to avoid issues with the R
ISET
short test when using the maximum charge current setting.
8.4 Thermal Information
bq2407x
THERMAL METRIC
(1)
RGT UNIT
16 PINS
R
θJA
Junction-to-ambient thermal resistance 44.5
R
θJC(top)
Junction-to-case (top) thermal resistance 54.2
R
θJB
Junction-to-board thermal resistance 17.2
°C/W
ψ
JT
Junction-to-top characterization parameter 1.0
ψ
JB
Junction-to-board characterization parameter 17.1
R
θJC(bot)
Junction-to-case (bottom) thermal resistance 3.8
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
8.5 Dissipation Ratings
POWER RATING
PACKAGE
(1)
R
θJA
R
θJC
T
A
≤ 25°C T
A
= 85°C
RGT
(2)
39.47 °C/W 2.4 °C/W 2.3 W 225 mW
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
(2) This data is based on using the JEDEC High-K board and the exposed die pad is connected to a Cu pad on the board. The pad is
connected to the ground plane by a 2 × 3 via matrix.
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