Product Specifications

CY8C29466/CY8C29566
CY8C29666/CY8C29866
Document Number: 38-12013 Rev. AB Page 50 of 67
Figure 25. 48-pin QFN (7 × 7 × 1.0 mm) 5.1 × 5.1 E-Pad (Sawn) Package Outline, 001-13191
Figure 26. 100-pin TQFP (14 × 14 × 1.4 mm) Package Outline, 51-85048
Important Note
For information on the preferred dimensions for mounting the QFN packages, see the application note Design
Guidelines for Cypress Quad Flat No Extended Lead (QFN) Packaged Devices – AN72845
available at http://www.cypress.com.
Important Note Pinned vias for thermal conduction are not required for the low-power PSoC device.
001-13191 *H
51-85048 *I