Datasheet

Table Of Contents
NEO-M8U - Data Sheet
UBX-15015679 - R06 Mechanical specifications Page 20 of 27
Product Information
5 Mechanical specifications
Symbol
Description
Min. (mm) Typ. (mm) Max. (mm)
A
Module height
15.9 16.0 16.6
B
Module width
12.1 12.2 12.3
C
Module total thickness
2.2 2.4 2.6
D, G
Horizontal edge to pin pitch
0.9 1.0 1.3
E
Pin to pin pitch
1.0 1.1 1.2
F
Gap width
2.9 3.0 3.1
H
Module PCB thickness
0.82
K1
Pad width (metal)
0.7 0.8 0.9
K2
Pad width (metal / solder mask)
0.7 0.8 / 0.9 0.9 / 1.2
M1
Pad height (metal)
0.7 0.8 0.9
M2
Pad height (solder mask)
0.7 0.9 1.1
N
Pad half-moon diameter
0.4 0.5 0.6
Module weight (g)
1.6
Figure 4: Dimensions
For information about the paste mask and footprint, see the NEO-M8U Hardware Integration
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